Job Description
It is an exciting time to join the Foundry Manufacturing and Supply Chain (FMSC) organization within Intel Foundry, as we grow to deliver Intel's IDM 2.0 Strategy. The Global Sourcing for Equipment and Materials (GSEM) is part of FMSC and is responsible for the supply chain supporting Intel's internal manufacturing technology and operations and sourcing tens of billions of dollars on behalf of Intel Foundry. The scope of the organization covers a wide range of goods and services from direct materials, equipment, spare parts and so much more. GSEM manages all aspects of technology and services required from external partners to develop, manufacture, and deliver Intel's technology and products to Intel's internal and external foundry customers. The organization's vision is 'Supply Chain is a competitive advantage powering Intel's Growth.'
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Within GSEM, our Advanced Packaging, Assembly and Test teams are responsible for developing and executing the back-end supply chain for Intel factories worldwide. This role is to lead Supply Chain Sourcing and Procurement across advance packaging, sort, C4 and test equipment sourcing for Intel Foundry. This team plays a critical role managing Intel's relationships with the external semiconductor ecosystem and ensuring the best use of ecosystem offerings to maintain Intel's technology leadership, profitability, and success of our customers.
Responsibilities:
We are looking for a strong sourcing and procurement leader that can help transform our back-end equipment selection, pricing and contracting in support of the Intel Foundry PnL. This Vice President of Advance Packaging and Test Supply Chain Sourcing role will act as the key interface to the semiconductor advanced packaging, assembly and test equipment industry executives from Intel Foundry. The expectation is that this leader has CEO level relationships across the equipment industry with the objective of steering mindshare and RandD investments in Intel's roadmap. This role is accountable for billions of dollars in annual CAPEX spending and for ensuring the technology in the ecosystem enables Intel's advanced packaging process technology roadmap (i.e. Fovoros, EMIB, Hybrid Bonding Processes) with leading semiconductor industry suppliers.
Key responsibilities include, but are not limited to:
- Manage Intel's advanced packaging and test equipment supply chain
- Own advanced packaging, assembly and test Sourcing strategy, roadmap and selection through equipment end of life along with cost, pricing, contracts, technology specifications from Components Research, Technology Development, through High Volume Ramp and Manufacturing.
- Work in collaboration with Assembly Test Technology Development in Foundry TD to understand their technology roadmaps and evaluate and select equipment for current and future fab technology.
- Deliver innovation by ensuring advanced packaging equipment suppliers invest RandD in capabilities needed for Intel's fab technology roadmap.
- Drive negotiation of pricing and contractual terms on behalf of Intel for advanced packaging and test equipment.
- Collaborate with Assembly Test Manufacturing (ATM), Disaggregated Manufacturing Operations (DMO) and Assembly Test Technology Development (ATTD) to ensure Intel's advanced packaging, assembly and test equipment performs at or above specification and industry benchmarks.
- Deliver predictable, uninterrupted, cost effective and agile supply chain and innovation for Intel Foundry.
The successful candidate should also exhibit the following behavioral traits:
- Must have an executive presence in engaging with suppliers at the CEO level with constructive confrontation and collaboration.
- High tolerance for ambiguity with ability to efficiently define concrete strategies and plans in such an environment.
- Proven expertise in bringing industry-leading equipment technologies from concept to HVM deployment in highly complex advanced technology environment.
- Demonstrated leadership and managerial skills aligned with intel culture and vision to produce technologies that changes the lives of every human on earth.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
- Possess a bachelor's degree (with 15-20 years of experience) or master's degree (with 10-15 years of experience) in science or engineering.
- MBA or equivalent business management qualifications is highly desirable.
- 15+ years of people management experience.
Preferred Qualifications:
- 15+ years of semiconductor capital equipment experience
- 15+ years of people management experience for capital equipment suppliers.
- Deep supply chain acumen, broad supply chain network, and ability to think strategically and analytically are fundamental to the success of this position.
- Proven expertise in advanced packaging/assembly/substrate manufacturing and supply chain.
- CEO level relationships across the equipment industry to steer mindshare and RandD investments in Intel's roadmap.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Other Locations
US, Phoenix
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.