Technical Support Engineer (TSE)
TSEs provide technical support remotely, and on site, to FSO personnel for highly complex problems involving equipment malfunction, on wafer issues, and performance enhancement programs where first-line product support was unable to isolate or fix a problem. Using advanced troubleshooting methodologies, they establish success criteria, develop comprehensive action plans, analyze and compile findings, perform root cause analysis and support FSO repair activities through escalation closure.
- Support multiple technical escalations, resolve with focus on time to resolution and quality of work
- Attend customer field issues meetings with FSO, collaborate with BU engineers
- Recommend best practices to improve products, processes, or services.
- Publishing Technical Lessons Learned, troubleshooting guides, technical (ET) papers, etc.
- Provide on-site coaching to FSO
- Provide Alpha and Beta Site support
- Support NPI development early in the product life cycle, and at key customer sites
- Support BU DFx (Design for Service / Install) projects
- Create, or collaborate in creation of, innovative advanced trouble shooting tools
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Business Expertise:
Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market.
Leadership:
Provides coaching to colleagues with less experience; may lead small projects with manageable risks and resource requirements.
Problem Solving:
Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information and data.
Impact:
Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies.
Interpersonal Skills:
Explains difficult or sensitive information; works to build consensus. Manage difficult situations in stressful environments.
Qualifications
- Education: Bachelor's degree or equivalent in technical field
- Skills:
- Ability to work independently and as part of a team
- Strong organizational and time management skills
- Excellent interpersonal and communication skills
- Ability to handle stressful situations and effectively manage difficult problems
- Familiar with suite of Microsoft Apps, and internal ones such as SAP, VSPI, and ARK
- Certifications: Applied Materials Etch Product Certification or equivalent.
- Languages: English (written and verbal)
- Years of Experience: 3+ years of experience with Applied Materials Etch products or similar
- Work Experience: Minimum 3 years of semiconductor fab experience
- Shift: Mon-Fri 8 hr per day
- Travel: Yes, generally 25% of the time, but could be as high as 50%.
- Relocation Eligible: No
Qualifications
Education:
Bachelor's Degree
Skills
Certifications:
Languages:
Years of Experience:
4 - 7 Years
Work Experience:
Additional Information
Shift:
10-Day 8-Hr (United States of America)
Travel:
Yes, 25% of the Time
Relocation Eligible:
No
Referral Payment Plan:
Employee Referral (Standard)
U.S. Salary Range:
$80,000.00 - $110,000.00
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.