RELOCATION ASSISTANCE: Relocation assistance may be availableCLEARANCE TYPE: Top SecretTRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.Northrop Grumman Microelectronics Center (NGMC) within Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Lithography Engineer for our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman's ATL semiconductor foundry provides unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development in superconducting electronics. Our devices enable multiple generations of Northrop Grumman's ground-based radars, avionic radars, and space systems. Join us for the chance to work with an experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term programs, and new programs targeting future military platforms.
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Our multidisciplinary foundry team enables activities spanning from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly. Candidates must be strong team participants, have excellent communication skills, and be resourceful as well as multi-disciplinary. A strong understanding of semiconductor technology, direct process development experience and production background is essential.
The Lithography Engineer must possess knowledge of lithography principles and practices, should be experienced with the full spectrum of exposure tools, photo-resin chemistry, developer chemistry, anti-reflective coatings, liftoff processes, image reversal, and thin-film strip and rework procedures. Engineer should also be familiar with a wide variety of metrology tools including CDSEM and overlay measurement. The selected candidate should be hands on, have an aptitude for technology development and demonstrate an ability to communicate well with others as well as experienced in coat defect resolution, film-thickness optimization, root-cause-analysis, and design of experiments.
The Staff Lithography Engineer will be responsible for:
-Leading process development for emerging technologies in both microelectronic and superconducting electronics.
-All aspects of maintaining production processes including process safety, process control, new process qualifications, technician training, preventative maintenance, tool troubleshooting and chemical inventory monitoring.
-Coordinating with stakeholders, including equipment vendors, engineering staff, product integration, and program and operations management, to define process needs, and establish manufacturing requirements.
-Performing trade studies and submitting costing proposals for the procurement of advanced semiconductor manufacturing equipment.
-Classifying manufacturing process windows and range of equipment capabilities.
-Writing and maintaining process documentation.
-Performing all other related duties as required.
#NGATL
Basic Qualifications:
Bachelor of Science degree in Chemical Engineering, Materials Science, Materials Engineering, Electrical Engineering, Chemistry, or related field with 12 or more years of related experience; an M.S. Degree with 10 years of experience; or a PhD with 7 years of experience.
Hands on experience in a clean room environment working with at least three of the following: I-Line Lithography, Nanoimprint Lithography, Electron Beam Lithography and Deep Ultraviolet Lithography processing tools.
Proficiency with Microsoft office.
Knowledge of statistical process control (SPC).
Excellent communication skills and the ability to work in a group environment.
Must be able to work a large percentage of time with handling of chemicals in a Class 100 cleanroom environment.
The ability to obtain and maintain a Top Secret clearance
U.S. Citizenship required
Preferred Qualifications:
A Masters or PhD degree in one or more of the fields mentioned above
Active Top Secret clearance
Extensive experience developing scalable micro-electronic fabrication processes
Experience conducting formal Root Cause Analysis to resolve process deficiencies on the following platforms:
Coater Tracks (positive and negative resists)
Layout BEAMER Fracture Software
CDSEM
Direct-write I-line Laser tools (e.g. Heidelberg)
Nanoimprint Lithography tools, either hard mask or soft mask
Raith 5200 Ebeam systems
DUV scanners/steppers
Experience as a Field Service Engineer on any of the above systems
Experience in the design of semi-conductor process architectures and fabrication of superconducting electronics.
Understanding of resist chemistries, especially broad spectrum and multi-sensitivity resists.
Experience in the design and execution of Acceptance, Test, and Evaluation of novel lithography tools and processes.
Experience leading cross-functional applications design projects.
Experience conducting formal trade studies and equipment specification for new and novel patterning processes.
Experience operating as a consultant or subject matter expert informing management and program decisions regarding process capabilities and requirements for superconducting and compound electronics
* Experience serving as a functional liaison between process integration, circuit designers, and physicists.
Salary Range: $163,200.00 - $244,800.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.