Sr. Principal RF Microwave Design Engineer
RELOCATION ASSISTANCE: No relocation assistance availableCLEARANCE TYPE: SCITRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.Northrop Grumman Space Systems sector delivers a decisive advantage to its customers through software-defined, hardware-enabled solutions. The Electrical Design and Analysis (EDA) section in Linthicum, MD enables these hardware solutions by providing technical expertise in the areas of architecture development, design, verification, and testing across a wide variety of electronic sensor products. Our engineers work on complex, leading edge, high reliability electronics supporting different space platforms.
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NGSP engineers share a great sense of pride knowing their contributions have a direct effect on the safety and security of the country and its allies. Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to accomplish the mission while learning and having fun along the way.
EDA is seeking a principal or Senior Principal Electronics Engineer with experience and interest in leading the RF subsystem electronics test, integration and verification activities. Typical responsibilities include but are not limited to:
Developing, planning, executing, and overseeing the integration and test activities for payload RF electronics subsystems.
Troubleshooting RF subsystems and mixed-signal assemblies based on schematics and component design documents utilizing various test equipment
Ensuring the hardware meets performance, functional, interface and requirements before delivery to Payload level
Coordinating with Electronic Circuit Assembly (ECA) designers, systems engineers, and test equipment team to ensure readiness
Managing HW/SW/FW integration of at the sub-system level
Developing and executing detailed test procedures to verify functionality and interfaces.
Participating in design reviews, Test Readiness Reviews (TRRs) and formal verification activities.
Support payload level integration with higher level assemblies and tests.
Supporting Low-Rate Space Production
Supporting some systems level electrical test and performance analyses
Leading testing and reporting activities
Managing technician workload and priorities
Developing test plans and managing its execution
Maintaining and coordinating calibration of test equipment
Interfacing customers and providing support as needed
Hands on integration and test support
Collaborating with cross functional groups to achieve desired outcome (management, engineering, reliability, mission assurance and production personnel)
Open to occasional shift support during pre-environmental testing (PET) and Thermal vacuum testing (TVAC) for system testing.
This position is in Linthicum, MD with easy access to the major cities of Baltimore to the north and Washington DC to the south. This position will require the candidate to be 100% on site.
Basic Qualifications:
Bachelor's degree in electrical engineering or comparable STEM degree minimum of 8 years of relevant engineering experience (6+ years with MS degree; or 3+ years with PhD)
Experience translating customer/system requirements into I&T plans, procedures, verification matrices and test scripts while addressing compliance at the product, component, and system levels.
Experience providing or presenting I&T tests, plans, activities or status at program reviews or technical meetings.
Ability to read and interpret schematics, assembly drawings, parts lists
Demonstrated ability to analyze and troubleshoot RF subsystems, complex mixed-signal ECAs and RF modules using schematics, component design documents, and basic lab test equipment.
Design, create, and modify Electrical Ground Support Equipment (EGSE) to support I&T activities.
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty.
Demonstrated Technical Team Leadership and ability to work on multi-disciplined engineering teams and communicate clearly within integrated product team (IPT) leads.
Basic understanding of the Design, Manufacturing, and Test process.
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA)
Proficient in RF/Microwave and mixed signal circuit design, schematic capture, and PWB/board layout
Completed and/or led multiple board designs from schematic capture to board release
Easily adapt to design challenges to meet program goals and deadlines.
Effective verbal and written communication
US Citizenship is required
Must have a Secret clearance at time of application with the ability to obtain and maintain a TS/SCI
Preferred Qualifications:
Active TS/SCI security clearance
Ability to create Design & Test Requirement documents and Operational Test Specifications
Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. Keysight ADS, Xpedition, Altium)
Fluency with developing and executing technical development plans.
Experience Integrating a system containing digital hardware, software and firmware
Experience as technical lead or other similar leadership role with demonstrated team building, organizational, and interpersonal skills
Test Coordination
Experience with standard test equipment (STE) design or support
Experience with environmental stress screening (ESS) including TVAC
Ability to troubleshoot Test bench issues from H/W and S/W documentation
Ability to manage technician workload and priorities
Ability to assess and generate reports for electrical over stress analysis
Expertise in working with receiver/exciters, conducting RF performance analysis, and implementing digital beamforming
Design, develop, creation and modification of test scripts utilizing (FPGAs) Xilinx and Microchip FPGAs
Experience with scripting languages such as TCL, Python or Perl
Embedded networking or high-speed protocols experience (Ethernet, PCIe, Interlaken, Infiniband, etc.)
Experience in Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses
Signal integrity analysis (SERDES, Bit error rates, jitter components and contributors, board to board analysis)
Experience in integrating FPGA/Digital controls on the bench (no VHDL experience required)
Understanding of basic signal processing
* RF budgeting, frequency planning, RF chain analysis and modeling
Primary Level Salary Range: $131,300.00 - $196,700.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
Perks and Benefits
Health and Wellness
- Health Insurance
- Dental Insurance
- Vision Insurance
- Life Insurance
- Short-Term Disability
- Long-Term Disability
- HSA
- HSA With Employer Contribution
- On-Site Gym
- Pet Insurance
- Mental Health Benefits
- Virtual Fitness Classes
Parental Benefits
- Birth Parent or Maternity Leave
- Non-Birth Parent or Paternity Leave
- Fertility Benefits
- Adoption Assistance Program
- Family Support Resources
- Adoption Leave
Work Flexibility
- Flexible Work Hours
- Remote Work Opportunities
- Hybrid Work Opportunities
- Four-Day Work Week
Office Life and Perks
- Commuter Benefits Program
- Company Outings
- On-Site Cafeteria
- Holiday Events
Vacation and Time Off
- Paid Vacation
- Paid Holidays
- Sabbatical
- Leave of Absence
Financial and Retirement
- 401(K)
- 401(K) With Company Matching
- Performance Bonus
- Relocation Assistance
- Financial Counseling
- Profit Sharing
Professional Development
- Tuition Reimbursement
- Promote From Within
- Mentor Program
- Shadowing Opportunities
- Access to Online Courses
- Lunch and Learns
- Internship Program
- Leadership Training Program
- Associate or Rotational Training Program
Diversity and Inclusion
Company Videos
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