RELOCATION ASSISTANCE: Relocation assistance may be availableCLEARANCE TYPE: SecretTRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.Northrop Grumman Mission Systems is seeking a Sr Principal Microelectronic Semiconductors Equipment Engineer for our Advanced Packaging Technology Fab - located in Apopka, Florida.
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Northrop Grumman's semiconductor foundry and packaging lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading-edge technology development.
The wafer bumping line will support flip chips, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar, using sputter, electro, and electroless plating, and solder-sphere transfer to support flip chips, 2.5D, and 3D packaging.
The Semiconductor Equipment Engineer will lead and manage engineering projects such as equipment layout, cleanroom construction, and installation of semiconductor equipment, along with the daily, weekly, bi-weekly, quarterly, semi-yearly, and yearly equipment maintenance.
Roles and Responsibilities:
Maintain all aspects of facilities and factory layout for foundry equipment.
Develop and apply continuous improvement programs and be responsible for all aspects of project management. Working with and direction of contractors/sub-contractors, along with alignment with management.
Be responsible for running a group or groups of tools, from day-to-day maintenance/preventative maintenance operations (i.e., chemical management) up to and including service contracts with vendors. Must be flexible to potentially work second shift.
Must be flexible to be on call.
Strong leadership and communication skills.
Demonstrated ability to work with cross-organizational teams such as engineering, line maintenance, and building maintenance
Minimal travel - one to three short trips per year.
Basic Qualifications:
You must have a bachelor's degree in a technical area with 8 years of relevant experience; 6 years with a master's degree in a technical area, 15 years of experience required with an Associate of Science in a technical area.
Minimum of 6-8 years' experience working with semiconductor fabrication equipment or the construction industry
Experience with semiconductor wafer fabrication facilities and operation
Experience with fab facility, equipment installation, and maintenance.
The ability to obtain and maintain a DoD Secret clearance.
Must be a US Citizen
Preferred Qualifications:
Experience with Mask Aligner, Coaters, Developers, Bonding, Debonding, and Track semiconductor equipment
Experience with semiconductor clean room design and construction.
Experience with Architecture and Engineering ("A&E") drawing sets
Experience with AutoCAD design
Experience in low volume/high product mix environments
Experience interfacing with vendors for equipment repairs, service contracts, and purchase preferred
Experience with Computerized Maintenance Management System
Proven track record managing strategic projects from inception through completion, including financial, risk, and schedule management
Personal Clearance Level- Secret
MANUMS
Salary Range: $118,600.00 - $178,000.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.