Research Scientist Intern, Image Sensor Design and Characterization (PhD)

Meta's mission is to give people the power to build community and bring the world closer together. Through our family of apps and services, we're building a different kind of company that connects billions of people around the world, gives them ways to share what matters most to them, and helps bring people closer together. Whether we're creating new products or helping a small business expand its reach, people at Meta are builders at heart. Our global teams are constantly iterating, solving problems, and working together to empower people around the world to build community and connect in meaningful ways. Together, we can help people build stronger communities - we're just getting started.Our team at Meta Reality Labs is dedicated to exploring new technologies and integrating them into custom image sensors. As an intern, you will have the opportunity to work on projects that push the boundaries of what is possible in the field of image sensors and contribute to the development of AR/VR devices.Our internships are twelve (12) to sixteen (16), or twenty-four (24) weeks long and we have various start dates throughout the year.

• Exploring innovative memory solutions for image sensor applications
• Model and simulate new devices with established sensor architectures
• Design optimized sensor readout circuits in advanced process nodes
• Assess the novel approach for data storage in ultra-low power image sensors
• Circuit layout and size optimization
• Interact with cross-functional engineering teams (Electrical Engineering, Firmware Engineering, Software Engineering, System Architects, Sensor Technology) to demonstrate novel imaging systems and camera hardware

• Currently has, or is in the process of obtaining a PhD in the fields of Electrical Engineering, Computer Science, or related field
• Must obtain work authorization in the country of employment at the time of hire and maintain ongoing work authorization during employment
• Proficient in designing optimized circuits and managing the tapeout process.
• Research experience in one or more of the following aspects of Image Sensors: Device physics and fabrication, Analog/mixed signal circuit design, Advanced high-density memory
• Experience with device modeling and circuit simulation.

• Experience with circuit design CAD tools such as Cadence Virtuoso
• 3+ years of experience with high-density memory and interface design
• 3+ years of experience in circuit design
• Tape out experience with advanced technology nodes
• Proven track record of achieving significant results as demonstrated by grants, or fellowships, as well as first-authored publications in major conferences and journals such as IEDM, VLSI, ISSCC, JSSC, TED.