EDA Packaging Education AE

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

At Cadence, we hire and develop leaders and innovators who want to impact the world of technology.

Location, remote, must be based in the US.

As part of the Cadence Education Services Team, you will create and deploy customer training for Cadence's state-of-the-art tools, languages, and methodologies. The training content that you develop will be for the classroom, virtual, and online delivery.
In this role, you will develop and update course lectures, labs, videos, and related collateral to enable our customers to become highly productive with Cadence tools in the shortest possible time.
You will work with Cadence product engineers, customer support AEs, marketing, the instructional design team, and R&D to design training materials that are focused, relevant, and highlight the product's latest features and methodologies.

• Working with product engineers, customer support, and R&D to determine training requirements.
• Creating and updating training lectures, labs, exams, and demos aligned with software releases and with high levels of quality.
• Designing and developing lectures, labs, and demos deployed online and in the classroom.
• Delivering courses in a classroom or virtual setting, as required
• Creating narrated online videos educating customers on how to use tools, languages, and methodologies.
• Supporting online training customers when there are questions related to lectures and labs.

• Excels at multitasking
• Enjoys a mixture of activities - authoring content, learning new tools and methodologies, "being the expert," teaching and interacting with customers, and working with highly competent and experienced engineers
• Given clear goals, is capable of working independently to accomplish such goals

• Has 5-8 years of experience in IC Package Design using Allegro X Advanced Package Designer
• Good understanding of IC package substrate construction (stack-up, vias, etc...)
• Good understanding of packaging technologies (BGA, LGA, Leadframe, etc...)
• Good understanding of interconnect technologies (Flip chip, Cu pillar & Wirebonds)
• Experience in IC packages manufacturing with emphasis on Design For Manufacturing (DFM) a plus
• Experience with schematic capture tools such as Allegro X System Capture and OrCAD X Capture a plus
• Has strong written and verbal English communication skills

• Has experience using Microsoft PowerPoint, Microsoft Word, and Microsoft Excel