Key Responsibilities:
- Package Architecture and DTCO (design technology co-optimization)
- Silicon and packaging process development
- Technology qualification and bring-up
- HVM supply chain development working with partners and internal teams
Requirements:
- 10+ experience in hardware and silicon-package development bringing products to market. Experienced in Heterogeneous Integration, Process and Design Enablement
- Strong knowledge and experience in Advanced Packaging 2.5D/3D/Fan-out/EMIB/SIP processes, design trade-offs and qualification.
- Strong Knowledge in Technology and Supply Chain, Design for Reliability.
- Experience/Exposure to board assembly process is a plus
- Vendor and Project Management: Work with 3rd party partners to bring technology from concept to HVM
- CAD: Exposure and familiarity with mechanical design tools such as SolidWorks, Creo is a plus
- FEA: Work with Mechanical and Thermal Design partners
- Industrial experience: 10+ Years' experience in Advanced Packaging product and process development and deployment
- Manufacturing: Excellent knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North America.
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Lab Skills:
- Experience with Design of Experiments, instrumentation, optical characterization, data acquisition and analysis, including uncertainty analysis.
- Understanding on mechanical and process characterization tools such as Optical inspection, Shadow Moire', DIC, FIB, SEM, TMA, DMA, MTS, X-ray, C-SAM, T-SAM
Academic Credentials:
(candidates must have the following qualifications for consideration)
- Master's or a Ph.D. in Physics, Electrical Engineering, Mechanical Engineering or related field AND 10+ years of (post college) work experience in Advanced Packaging technology and product bring-up role
Successful candidates must be eligible to lawfully receive export-controlled information, without the need for the company to seek a license. Furthermore, since the role entails work on a US government funded project, the successful candidate must also be able to meet the government's requirements for eligibility to participate in the project, without the need for the company to seek an exception/extraordinary approval. The government's requirements include certain restrictions on nationality and association/affiliation with entities deemed to be of concern.
Qualifications
Education:
Bachelor's Degree (Required), Doctorate Degree, Master's Degree (Required)
Skills
Certifications:
Languages:
Years of Experience:
15+ Years
Work Experience:
Additional Information
Shift:
10-Day 8-Hr (United States of America)
Travel:
Yes, 20% of the Time
Relocation Eligible:
Yes
Referral Payment Plan:
Employee Referral (Standard)
U.S. Salary Range:
$200,000.00 - $275,000.00
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.