We are seeking a motivated and detail-oriented Process Development Engineer to join our team. This position offers a unique opportunity to work on advance packaging project. The successful candidate will be working on process development related to packaging substrate fabrication.
Key Responsibilities
- Bring-up and qualify new equipment
- Develop new processes and transfer to pilot production
- Establish metrology protocol
- Utilize statistical tools and software to analyze data and identify trends, anomalies, and opportunities for process optimization.
- Prepare detailed reports and presentations summarizing findings and recommendations.
- Support the development and implementation of process improvements based on experimental results.
- Maintain accurate documentation of experiments, methodologies, and results.
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Functional Knowledge
- Demonstrates expanded conceptual knowledge in own discipline and broadens capabilities
Business Expertise
- Understands key business drivers; uses this understanding to accomplish own work
Leadership
- No supervisory responsibilities but provides informal guidance to new team members
Problem Solving
- Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents
Impact
- Impacts quality of own work and the work of others on the team; works within guidelines and policies
Interpersonal Skills
- Explains complex information to others in straightforward situations
Successful candidates must be eligible to lawfully receive export-controlled information, without the need for the company to seek a license. Furthermore, since the role entails work on a US Government funded project, the successful candidate must also be able to meet the Government's requirements for eligibility to participate in the project, without the need for the company to seek an exception/extraordinary approval. The Government's requirements include certain restrictions on Nationality and Association/ Affiliation with entities deemed to be of concern.
- Experience in copper electroplating and plating chemical analysis
- Experience with electronic packaging fabrication and characterization techniques.
- Previous hand-on experience with tool operation and process development in PCB or semiconductor industry.
Qualifications
Education:
Bachelor's Degree
Skills
Certifications:
Languages:
Years of Experience:
2 - 4 Years
Work Experience:
Additional Information
Shift:
10-Day 8-Hr (United States of America)
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
Referral Payment Plan:
None
U.S. Salary Range:
$100,000.00 - $136,500.00
The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.