College Intern

Metal electroplating for advanced semiconductor packaging application

Rapid development of high-performance computing and artificial intelligence drive the demand for advanced semiconductor packaging, to enable integration of diverse components into a single device to achieve high performance and efficiency. Plating innovations are needed in participant the technology inflections for Advanced Packaging including high-speed plating, scaling for high-density module, and additive control to enable low temperature hybrid-bonding.

Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible the technology shaping the future.

As an intern, the candidate will get the opportunity to work alongside with experienced chemists, engineers, collaborators and gain hands-on experience. His/Her key responsibilities include assisting chemists on design of experiment (e.g. experiments in wet chemical lab and metal plating), collect data, analyze, and compile reports on a variety of experiments, within safety guidelines. Generate internal and external documentation for presentations and technical reports.

Qualifications

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Additional Information

Shift:

Day (Singapore)

Travel:

No

Relocation Eligible:

No

Referral Payment Plan:

None

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.