Advanced Packaging Process Integration Principal/ Staff Engineer

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:
Singapore,SGP

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

As a Process Integration Principal/ Staff Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.

Responsibilities:

• Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
• Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
• Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
• Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
• Owns, manage, and drive technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion.

Experience:

• Around 10 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly.
• Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
• Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
• Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
• Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
• Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome.
• Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.

Work Location:

• Science Park II

Additional Information

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:
Yes, 20% of the Time

Relocation Eligible:
No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Client-provided location(s): Singapore

Job ID: Applied_Materials-R2516029

Employment Type: FULL_TIME

Posted: 2025-08-01T00:17:57