PCB DFM Engineer

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. The people here at Apple don't just create products - they create the kind of wonder that's revolutionized entire industries. It's the diversity of those people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it.

Description

The PCB Substrate DFM Engineer will have a deep level of creativity and curiosity about materials science and electronic packaging at all levels. The responsibilities of this role include: - Maintenance of printed circuit board and substrate design rules for all Apple products, as well as the technology roadmap and acceptability specifications - Establishment and maintenance of supplier site, material and technology qualification matrix - Action as the directly responsible individual on all substrate and printed circuit board related quality issues and excursions In the course of fulfilling these responsibilities the person in this role will: - Provide mentorship to product designers on available substrate and printed circuit board technologies and materials - You will interact with and guide PCB and substrate layout designers to select layer structures, design rule sets and practices - Work with design tool engineers to define and validate appropriate scripting, design rule checks, etc - You will support design for cost investigations as the liaison between engineering and procurement - Audit and assess PCB and substrate vendor production lines, including manufacturing techniques and quality control systems - Review new technology qualification data and make disposition decisions - Review new product introduction first article data and make disposition decisions - You will drive corrective actions for PCB and substrate vendor issues using step-by-step methodology

• 3+ years experience with printed circuits including hands-on process engineering experience
• Demonstrated capability of qualifying new materials, chemistries, equipment sets and/or processes to high volume production
• BS or higher in materials science, chemical, mechanical or electrical engineering

• Strong knowledge of industry specifications, especially IPC and JEDEC specifications
• Understand the interaction between manufacturing processes and environments with printed circuit defect conditions, especially latent defects
• Understand statistical process and quality control principles and be capable to apply statistical analysis methods to raw data sets
• Understand the relationships between design rules, process capability, yield and product reliability and how to improve them