42 jobs for "Lead Engineer - Mechanical Component & Analysis"

IC Packaging Integration Engineer

At Apple - Austin

Posted on Oct 17

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DLE Engineer - Hot Gas Path

At GE Vernova - Bengaluru

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ENGLD | Aerospace Engineer | Producibility | Karlovac

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Posted on Nov 3

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Lead Release Engineer

At General Motors - Warren

Posted on Oct 19

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Maintenance Engineer

At Schneider Electric - Oxford

Posted on Oct 30

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Lead Yaw System Mechanical Design Engineer-1

At GE Vernova - Greenville

Posted on Oct 30

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Display Engineer

At Apple - Shenzhen

Posted on Oct 16

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Engineer II, PCB Qualification

At Schneider Electric - Cavite

Posted on Oct 23

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Lead Engineer - Yaw Systems

At GE Vernova - Greenville

Posted on Oct 30

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Senior Electrical Engineer

At Waters - Goleta

Posted on Oct 14

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Principal Mechanical Design Engineer - Data Center Infrastructure (REMOTE)

At Jabil - Remote / Flexible

Posted on Oct 27

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Mechanical Design Engineer

At Hitachi Energy - South Boston · Alamo

Posted on Oct 28

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CPE Engineer - fixed term

At Aptiv - Gdansk

Posted on Nov 6

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Staff Mechanical Engineer - Future Opportunity

At Intuitive - Sunnyvale

Posted on Oct 22

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IC Packaging Integration Engineer

At Apple - Austin

Posted on Oct 17

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Lead Yaw System Mechanical Design Engineer-2

At GE Vernova - Greenville

Posted on Oct 30

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Senior Mechanical Design Engineer - Wind Turbine Driveline Systems

At GE Vernova - Barcelona

Posted on Oct 21

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Lead Engineer - Fleet Management

At GE Vernova - Schenectady

Posted on Oct 16

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Mechanical RCA Engineer - Machine Head

At GE Vernova - Greenville

Posted on Oct 15

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Display Engineer

At Apple - Cupertino

Posted on Oct 19

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Apple

IC Packaging Integration Engineer

Austin, TX$184,700 – $324,800Posted 23 days ago

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Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team!

Description
• You will be responsible for IC packaging development
• Work with cross-functional teams and lead SoC Package integration and architecture efforts
• Drive the industry with advanced package solutions, new material developments, and specs","responsibilities":"Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements.

Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).

Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.

Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution.

Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement.

Preferred Qualifications

MS/PhD and 6+ years of experience in relevant industry.

We are looking for someone experienced in the semiconductor packaging and/or system integration.

Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.

Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.

Excellent problem solving with strong physics and fundamentals.

Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.

Basic knowledge of signal integrity/power integrity.

Ability to review schematics, package/PCB layout and designs in Allegro.

Minimum Qualifications

BS and 10+ years of experience in relevant industry experience

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

About Apple

Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.

Size: 10,000+ employees
Industry: Technology

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