Senior Product Applications Engineer II
Regional technical authority for next-generation AI and HPC infrastructure, owning technical strategy, solution architecture, customer engagement, and
ecosystem development for advanced liquid cooling technologies across hyperscale, enterprise AI, and HPC deployments. Recognized as a trusted technical
advisor to consultants, hyperscalers, Specialized Datacentre EPCs, engineering firms, and strategic customers covering full project technical lifecycle - from
specification and technology selection to tendering, value engineering, Ecosystem upskilling and award.
2.1 Technical Leadership
• Act as regional technical authority for AI-ready DC infrastructure and liquid cooling; lead technical development of AI/HPC projects requiring high-density
environments.
• Define/ Deploy reference architectures and best practices; establish technical governance for liquid cooling deployment; support executive leadership on
technology strategy and competitive positioning.
2.2 AI & Liquid Cooling Expertise
• Direct-to-Chip (D2C), Rear Door Heat Exchangers (RDHx), Immersion Cooling, TCS and Secondary Network Heat (SFN) loops, CDU architecture & facility heat
exchanger FWS design .
• Glycol/water loop engineering, hydraulic balancing, pumping systems, thermal management, heat rejection, water/ Mix Liquid quality management, facility
hydraulic integration.
• Optimize air/liquid capture ratio, air-to-hybrid transition strategies, AI rack thermal management, high-density racks (>80-150+ kW/rack), thermal resilience,
redundancy and energy efficiency.
2.3 AI Infrastructure Design
• Lead design for AI Pods, GPU clusters, NVIDIA HGX/MGX, NVL platforms, large GPU clusters, HPC and AI Factory architectures, high-density white space.
• Rack architecture, containment, high-performance airflow, power distribution integration, 800VDC-ready infrastructure, busbar systems, AI-ready POD
compute topology, mechanical-electrical integration.
2.4 Presales & Specification Leadership
• Support Sales, coach BD teams, enable Presales, influence consultants, engineering firms, EPC / DCS contractors, hyperscalers and AI ecosystem partners.
• Lead specification development, design reviews, technology positioning, competitive differentiation, customer workshops, executive presentations and
design validation.
2.5 Tendering & Value Engineering
• Own the full technical tendering process: qualification, architecture validation, risk assessment, design optimization, compliance review, value/cost
engineering, technical negotiations, bid defense, customer clarifications and final technical approvals through to award.
2.6 Customer & Ecosystem Engagement
• Build trusted relationships with hyperscalers, enterprise customers, AI infrastructure providers, consultants, design institutes, EPC/mechanical contractors
and channel partners.
• Represent the organization at executive workshops, industry conferences, technical seminars, customer advisory sessions and AI technology forums.
3. Required Competencies & Technical Expertise
AI Infrastructure:
GPU infrastructure, HPC architecture, AI Factory design, large-scale AI
clusters, rack density optimization, thermal management, AI-ready
electrical infrastructure.
Critical DC Infrastructure
Tier III/IV architectures, white space & containment, precision cooling,
chilled water, CRAH/CRAC, in-row cooling, RDHx, high-availability
mechanical systems, mission-critical redundancy. DC infrastructure Digital Twin, Desing simulation, DCS Software stack
Liquid Cooling
Direct Liquid Cooling & Immersion Cooling, TCS/SFN, CDU technologies,
heat exchangers, hydraulic systems, pumping stations, thermal
modeling/CFD, heat recovery concepts.
Electrical Distribution
800VDC technologies, High density Power train architecture, integrated
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Compute critical infrastructure AI POD Skid .
Industry knowledge: Vertiv, ABB, Schneider Electric, Carrier, Johnson Controls, STULZ, Munters, LiquidStack, CoolIT Systems, Motivair, Boyd, Submer, GRC, nVent,
Delta Electronics, Huawei Digital Power, Equinix reference architectures, NVIDIA AI Infrastructure ecosystem.
• 12-15+ years in mission-critical data center infrastructure; minimum 7 years dedicated to high-density cooling technologies.
• Demonstrated experience on AI/HPC infrastructure projects and proven expertise in liquid cooling architecture and deployment.
• Extensive experience leading technical tendering and value engineering; strong customer-facing experience with hyperscalers, enterprise accounts, EPCs and
consulting firms.
• Demonstrated success influencing technical specifications and securing major infrastructure projects.
• Recognized technical authority for AI cooling technologies; mentor regional presales/engineering organizations; build technical competency and drive
innovation and technology adoption across the region.
• Deliver: regional AI/liquid cooling technical strategy, standardized AI reference architectures, technical enablement of sales/BD/presales, consultant and
specification engagement plans, and technical ownership of strategic AI opportunities.
• Deliver: end-to-end tendering and value engineering leadership, regional design guidelines and enginee
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