Principal Engineer Microelectronic Semiconductors

Northrop Grumman Mission Systems is looking for you to join our team as a Principal Microelectronics Semiconductor Metals Process Engineer for our Advanced Packaging Technology facility in Apopka, FL.

The Principal Microelectronic Semiconductor Metals Process Engineer will provide senior fabrication support and technical direction for a wide range of metals processes and tools for semiconductor wafers. The selected candidate will own the responsibility for process technology development and production deployment for multiple metal interconnect processes, including PVD and solder bumps fabricated across multiple equipment systems.
They will collaborate closely with other process owners for back-end post-processing to ensure satisfactory integration of under bump metallization and sphere drop processes into overall product flows for both production parts, as well as new process and product development activities.
The chosen candidate must have excellent verbal and written communication skills; be able to multitask in a fast-paced, dynamic, and high-visibility environment; and work well as part of a team.
The position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required.
What You'll get to Do:
Team:

Primary metals team leader responsible for all PVD and plasma clean processes, development, and associated metrology. The role will require experience with production deployment across a broad range of tool sets, processes, and wafer sizes.
Work closely with cross-functional teams in Process Engineering, Manufacturing, Quality, Integration, and R&D to ensure process stability, improve yield, high-volume ramp, and drive continuous improvement initiatives.
Mentor and train junior engineers and technicians on shift to support quality and delivery metrics for operations.
Drive process improvements for new technology insertion to improve process robustness and achieve technology milestones for yield, reliability, and cost.

Excellent oral and written communication skills with a strong attention to detail.
The ability to lead and work efficiently in a group or as an individual contributor.
Demonstrated ability to lead complex multi-tool process development projects
Fluency in MS Office software applications
Process/ Equipment Management:

Oversee and develop robust, manufacturable process recipes for Foundry customers in PVD, plasma cleaning, and bumping processes, and the associated metrology and analysis using designs of experiments (DOEs) and industry standard methods.
Identify, resolve issues, and improve these plating processes to provide maximum quality and process availability.
Ensure all metal equipment is properly qualified and calibrated.
Process Development:

Define and optimize PVD thin films, plasma cleans, dry etching(metal etch), sphere drop, and redistribution layers for bumping processes in support of new technologies.
Develop new technologies across the portfolio of emerging technologies in semiconductor wafer-level interconnect manufacturing on multiple wafer sizes.
Quality Control:

Execute strategic projects for improvement of sustaining operations through monitoring statistical process control (SPC) charts and disposition of out-of-spec material.
Support process control, planning, safety, and quality organizations to ensure the equipment meets cost, quality, safety, and reliability metrics.
Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for critical processes, process modules, and tools.
Problem-Solving:

Drive process improvements for volume manufacturing using statistical tools, DOE techniques, data-driven decision making, and systematic problem-solving skills.
Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for critical processes, process modules, and tools.
Safety Compliance:

Adhere to all safety regulations and protocols to maintain a safe working environment.
Vendor Management:

Collaborate and drive continuous improvement projects with both equipment vendors and materials suppliers.
Support capital equipment projects through procurement, installation, and release for production use
Production Support:

Achieve customer on-time delivery and cycle time commitments through tool qualification and OEE management with manufacturing operations.
Coordinates with production on day-to-day activities. Assists in the resolution of production workflow issues.
Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for critical processes, process modules, and tools.
Documentation & Data Systems:

Maintain accurate records of processes/recipes, quality checks, and maintenance activities.
Support engineering data analysis, including metrology data, ERP and MES data, and other in-process metrics

Basic Qualifications for Principal Microelectronics/Semiconductor Metals Process Engineer:

BS Degree in Materials Science, or a related STEM field with a minimum of (5) years of Semiconductor Metals (PVD) and/or Alloys experience, or (3) years with a master's, or (0) years with a PhD
Proficiency in semiconductor PVD process control and process development
Proficiency in process set-up, optimization, and troubleshooting for PVD, plasma clean, and bumping toolsets
Strong understanding of vacuum technology, thin-film stress, adhesion, uniformity, and contamination control
Experience with under bump metallurgy, and optimizing plasma parameters (RF power, gas chemistry, pressure, bias, time) to achieve residue-free surfaces.
Experience fabricating a wide variety of interconnect technologies and metals, including lead and lead-free solders and other metal systems.
Experience in a production manufacturing environment
Experience in Design of Experiment (DOE), Statistical Process Control (SPC), and 6 sigma concepts for process development and control
Experience in conducting FMEA analyses of processes and equipment
Experience in technical data collection, organization, and analysis skills
Proficient in data analysis techniques/programs
Familiarity with Enterprise Resource Planning and Manufacturing Execution Systems
US Citizenship is required
The ability to obtain a DOD Secret Clearance is required
Preferred Qualifications for Principal Microelectronics/Semiconductor Metals Process Engineer:

Experience with JMP, MATLAB, VBA, and/or similar
Expert in 8D Problem Solving
Experience with CAD software (AutoCAD, NX, or similar)
Experience with Minitab software
Experience with SAP MRP software
Strong integration skillset across lithography, plasma descum, wet cleans, electroplating, etch, AOI, and reflow
Characterize surface cleanliness using SEM, FTIR, ellipsometry, contact angle, and XPS
Experience in flip-chip, 2.5D, and 3D packaging
Active Secret Clearance or Higher
Six Sigma Blackbelt Certification
What We Can Offer You:
Northrop Grumman provides a comprehensive benefits package and a work environment that encourages your
growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the
flexibility and control to choose the benefits that make the most sense for you and your family.
Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off, and Additional Benefits, including
Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!
Primary Level Salary Range: $98,400.00 - $147,600.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

Client-provided location(s): Apopka, FL

Job ID: NorthropGrumman-R10216517

Employment Type: OTHER

Posted: 2025-12-24T20:06:33