Silicon Reliability Engineer

Reality Labs is focused on ensuring the highest quality and reliability of our advanced silicon products. We are seeking a Lead Silicon Reliability Engineer to drive reliability strategies and lead efforts to deliver robust silicon solutions.

Silicon Reliability Engineer Responsibilities:

• Lead the development, execution, and continuous improvement of silicon reliability qualification strategies aligned with industry standards and customer requirements
• Act as the technical authority, holding in-depth subject-matter knowledge for silicon reliability across the organization
• Collaborate with suppliers, product engineering, design, packaging, process, and test teams to influence design-for-reliability early in product development
• Work with development partners and OSATs to align qualification methodologies and reliability expectations
• Define and oversee reliability test plans including HTOL, HAST, TC, HTS, EM, TDDB, NBTI, and other stress tests
• Lead failure analysis and root cause investigations using advanced tools such as TEM, SEM, FIB, and EMMI
• Work with suppliers to ensure complete and accurate documentation of reliability test plans, procedures, and reports
• Contribute to internal training and knowledge sharing

• M.S. in Electrical Engineering, Materials Science, Physics, or related field with 8+ years of relevant work experience
• Proven leadership in silicon reliability for high-volume consumer, automotive, or high-performance computing products
• Demonstrated understanding of CMOS device physics, aging mechanisms (NBTI, HCI, TDDB), failure analysis techniques, and reliability modeling
• In-depth knowledge of JEDEC and other relevant industry standards
• Hands-on experience with statistical data analysis tools
• Proven communication and leadership skills in influencing cross-functional teams and upper management

• 15+ years of experience in semiconductor reliability engineering, with a focus on advanced silicon technologies
• Experience in semiconductor device physics research and reliability modeling
• Experience working with foundries (e.g., TSMC, Samsung, Intel) and advanced process nodes (e.g., 5nm, 3nm)
• Experience in advanced packaging technologies System-in-Package, 3D, 2.5D packaging