Principle SI/PI/Thermal Analysis Solutions Engineer

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

This position involves delivering advanced packaging and 3DIC analysis flows for foundry and customer solutions primarily using Cadence SI/PI and Thermal tools (Sigrity, Clarity, Celcius). The person that fills this position is expected to work in a team environment creating and implementing 3DIC reference flows and designs.

The candidate is expected to be anhave advanced knowledge of advanced packaging signal and power integrity analysis tools and flows. Must have experience using Sigrity, Clarity or Celcius. Experience with multiple 3DIC configurations required. Knowledge of the CMOS sign-off design flow a plus.

Position requires:

• Bachelor's degree (Masters preferred) in Electrical or Electronics Engineering
• Minimum 10 years experience with package design
• Minimum 2 years experience with Cadence SI/PI/Thermal tools
• Strong knowledge of advanced packaging concepts
• Strong knowledge of 2.5D, 3DIC and stacked die technologies
• Strong customer-facing communication and problem-solving skills
• Strong personal drive for continuous learning and expanding professional skill sets
• Excellent verbal and written communication skills