Principal Product Enigneer - Integrity 3D-IC/Innovus

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

We are looking for a highly motivated and creative Product Engineer to work for Integrity 3D-IC and Innovus. The successful candidate will be responsible for assisting in the development of the design flows for leading-edge 3D IC designs. The design flows will be based on Cadence Integrity 3D-IC platform that covers all aspects of the 3D IC integration including the system-level planning, physical implementation, timing/PSI/thermal analysis, and physical verification. Among them, the successful candidate will be working primarily on the system-level planning and physical implementation using Integrity 3D-IC and Innovus.

The initial focus for this role will require the close engagement with global top-tier customers. The successful candidate will be required to 1) understand the design specifications and challenges in customer's advanced package designs, 2) work with the internal R&D and field engineer teams to develop and validate new Integrity 3D-IC-based design flows for seamless 3D IC integration, and 3) provide the R&D teams with the customer feedback, competitive threats/opportunities, and other general field intelligence on 3D IC designs in order to align the product development direction with customers' technical needs.

1) Minimum Qualifications

• BS in Electrical Engineering, Computer Engineering, Computer Science, or a closely related field.
• 9+ years of hands-on experience in ASIC digital implementation or relevant fields.
• In-depth understanding of the latest EDA tools for physical design.
• Excellent interpersonal and team communication skills.
• Strong analytical and problem-solving skills.
• Knowledge on script languages (Tcl, Perl, Python, or similar).
• Ability to fluently speak and write in English.

• MS in Electrical Engineering, Computer Engineering, Computer Science, or a closely related major.
• 10+ years of hands-on experience on ASIC digital implementation or relevant fields.
• Deep understanding of design methodology and tools features for 3D integration.
• Knowledge on the design challenges in the advanced package design.
• Understanding of deep sub-micron design problems and solutions.