Lead Product Engineer

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Job Responsibilities:
Develop, validate, and deploy 3D-IC system-level design planning & physical implementation flow.
Design flow automation for 3D-IC system-level analysis & physical verification and verify simulation results.
Work closely with cross-functional teams, project managers, and customers to explore, develop and drive 3D-IC implementation, RC extraction, analysis, and verification flow enablement.

Job Requirements:
Solid working knowledge and hands-on experience in synthesis, block, or top-level physical PnR implementation, and signoff flows.
Strong programming and scripting skills in Tcl and Shell.
BS or MS degree in EE, EECS, or CE with 5 years of engineering experience in the semiconductor industry.
Excellent skills in problem-solving, written and verbal communication, excellent organization skills, and highly self-motivated.
Independent, self-starter who can work across a worldwide organization and customer base.

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