Application Engineering II: Silicon Package Board

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Cadence Design Systems is looking for a Application Engineer II: Silicon Package Board (SPB) team as a full-time engineer focused on Advanced Packaging Design. If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.

Job Description:

• The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set, working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies.
• Ability to understand schematic, layout, interposers, integrated components.
• Working closely with our customers who are in the Advanced Packaging space
• Helping customers to adopt and proliferate our packaging solutions
• Consulting customers to understand their flow requirements and creating solutions that best meet their needs
• Conducting technical presentations, technical training, and product demonstrations, including development of customized presentations
• Supporting technical evaluations and benchmarks
• Collaborating with Sales Management to identify and prioritize opportunities, and to assist in developing winning sales strategies
• Help R&D and product engineers develop competitive and creative technical solutions
• Working with Cadence Engineering and Marketing to communicate requirements and drive resolution of issues

• Complete Bachelors in Electrical, Electronics, System Engineering, Computer Science or related areas
• Excellent written and verbal communication skills
• Interest in learning new technologies
• Open to continued personal development to meet the evolving demands of the EDA industry
• Previous experience with Package or PCB Design
• Knowledge of scripting programming languages such as Tcl, Perl, Python, bash, csh
• Solid verbal and written communication skills
• Exceptional problem-solving skills
• Ability to work independently and productively in a fast paced and dynamic environment

• Practical experience with Cadence IC packaging tools
• Knowledge of interposer technology, the latest trends and the advancement of Heterogenous Integration applications
• Electromagnetics, and RF related to IC Package and PCB Design
• Knowledge of EDA industry, Signal and Power Integrity

• Employment category: CLT
• Employment term: 40 hours/week.
• Competitive benefits.
• Location: Av Contorno 5800, Belo Horizonte, Minas Gerais Brazil.