Panel-level Advanced Packaging Process Engineer (PVD)

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world's technology.

What We Offer

Location:
Hwaseong-Lucestar,KOR

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

• Provide on‑site technical support for Applied Materials PVD metal deposition systems on panel‑level platforms, including installation, qualification, troubleshooting, and long‑term process stabilization.
• Support, maintain, and optimize PVD metallization processes including seed, barrier, and RDL-related metal stack deposition for panel-level packaging applications.
• Design and execute process development activities and DOEs, analyze data using statistical methodologies, and provide technical recommendations for process optimization.
• Diagnose and resolve complex process and equipment issues on large‑format panel substrates using structured root cause analysis methodologies.
• Address panel‑specific challenges such as film uniformity across large panel areas, panel warpage/handling, and edge‑to‑center metal profile control.
• Collaborate closely with customers, field teams, and internal engineering groups to achieve technical and operational objectives.
• Leverage best practices and proven solutions to deliver practical and innovative process improvements.
• Serve as a technical resource and mentor for junior engineers and support small to mid‑scale projects as assigned.

• Master's or Bachelor's degree in Materials Science, Chemistry, Semiconductor Engineering, or a related technical discipline.
• 3-10 years of experience in semiconductor process engineering, equipment support, or advanced packaging environments.
• Strong sense of ownership, attention to detail, and ability to work in physically demanding fab environments.
• Excellent communication and interpersonal skills for customer‑facing technical support.
• Proficiency in English for technical documentation and global collaboration.
• Willingness to work at and travel between the Cheonan and Dongtan sites as required.

• Master's or Bachelor's degree in a relevant engineering field.
• Hands‑on experience with PVD metallization (seed, barrier, and metal‑stack deposition).
• Knowledge of advanced packaging technologies including FOPLP, chiplet integration, and heterogeneous packaging.
• Understanding of process integration challenges in large-format panel PVD processing equipment and related metallization technologies.
• Experience supporting advanced packaging and metallization processes in both wafer-level and panel-level manufacturing environments.
• Prior on‑site customer support or field engineering experience.
• General understanding of back‑end‑of‑line (BEOL) and panel‑level packaging process flows, including RDL metallization.

• Work directly with leading global semiconductor manufacturers on cutting‑edge panel‑level advanced packaging technologies.
• High‑impact, customer‑facing role with strong technical ownership and visibility.
• Opportunity to grow into a subject-matter expert in panel-level packaging, metallization, and PVD process technologies.
• Collaborative, technology‑driven, and innovation‑focused work environment.