Field Focal Product Line Management

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:
Bangalore,IND

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Job Description

Product Line Manager

Our Team:

The Common Solutions Service Business Unit (CSG SBU) focuses on creating service value and developing new service products and capabilities that span multiple equipment platforms, including robotics and automation systems. We lead key initiatives that support service business objectives and leverage core strengths in product marketing, program management, semiconductor equipment, and field service.

The opportunity and what you'll do:

CSG SBU is seeking a collaborative team player who is passionate about driving technical programs in a cross‑functional environment, influencing new product designs, developing innovative service products, and delivering actionable insights to improve field productivity and resolve operational issues that enable service and equipment growth.

Key Responsibilities:

Field Escalation support & Customer Engagement

• Lead cross‑functional field escalations with field service organization, global product support, and engineering, driving root‑cause analysis, corrective actions, and documentation updates to strengthen future releases.
• Support on‑site assessments and customer pilots to validate solutions, ensure readiness, and accelerate adoption of service capabilities.
• Provide field installation support by identifying procedural and documentation gaps, driving containment actions, and implementing improvements that enhance service execution.

• Drive internal and customer‑facing documentation programs for legacy and new products; lead IP/content reviews and release readiness with Tech Publications.
• Lead the creation of troubleshooting guides and Out‑of‑Control Action Plans to enable AI‑driven field support initiatives.

• Partner with global product support, Tech Publications, and BU Engineering to meet readiness gates and launch criteria globally.
• Lead end‑to‑end service readiness for Wafer Fab equipment, ensuring training, documentation, spares strategy, tooling, and CE certification are in place at each gate
• Drive design for installation, design for service, and design for automated service programs

• Own delivery and validation of platform Digital Tool packages (Robotics and automation modules) and integrate them into service product releases.
• Lead pilot/demo execution, assess productivity and tool‑uptime improvements, and perform economic value analysis.

• Drive field productivity and capability improvement by identifying target improvement areas and drive improvement initiatives.
• Lead field training and technical development across new platforms, complex upgrades, advanced controls, robotics, and capture BKMs.
• Ensure operational readiness by driving special tooling introduction, validation, global availability, and adoption.

• Implementation of cost reduction roadmap, through repair/refurbishment solution development and implementation

• Cross‑functional leadership and escalation management, driving alignment across Field Service, Global Product Support, Engineering, and customer teams.
• Technical expertise in robotics, and automation system, with strong capability in root‑cause analysis, solution validation, and service readiness. Semiconductor equipment is preferred.
• Expertise in technical documentation development, including installation procedures, troubleshooting guides, OCAPs, and release/IP readiness in partnership with Tech Publications.
• Program and project management skills, leading NPI service readiness, global deployment activities, tooling readiness, and digital tool (DT) package integration.
• Operational and business acumen, enabling productivity improvement, capability development, cost‑reduction initiatives, and service gross‑margin optimization.