Director, Process Support Engineer (Advanced Packaging)

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world's technology.

What We Offer

Location:
Singapore,SGP

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

About the Role

Join Applied Materials and help shape the future of semiconductor innovation through advanced packaging technologies. As a Director, Process Support Engineer, you will serve as a key technical leader, partnering with customers and internal R&D teams to drive process optimization, technology adoption, and next-generation advanced packaging solutions.

Key Responsibilities

• Lead the resolution of highly complex customer process challenges across advanced packaging applications using systematic troubleshooting, root cause analysis, statistical methodologies, and Design of Experiments (DOE).
• Establish and drive cross-functional issue management mechanisms, coordinating resources across Business Units, Engineering, Service, Product Development, and Customer Support organizations to ensure timely resolution and knowledge sharing.
• Provide technical leadership for customer demonstrations, proof-of-concept activities, and technology evaluations, including defining process conditions, analyzing results, and presenting recommendations.
• Partner closely with strategic customers to develop and optimize advanced packaging process flows, translating customer requirements into viable technical solutions that meet performance, yield, and manufacturing objectives.
• Act as a trusted technical advisor and subject matter expert for advanced packaging technologies, including wafer-level packaging, fan-out, RDL, hybrid bonding, bumping, TSV, heterogeneous integration, and next-generation interconnect solutions.
• Collaborate with product development and engineering teams to influence product roadmaps, identify technology gaps, and drive process and hardware enhancements aligned with customer and market requirements.
• Lead technology transfer and customer enablement activities, including customized process development, process integration, qualification planning, and production ramp support.
• Build strategic partnerships with leading semiconductor manufacturers, OSATs, research institutes, and ecosystem partners to evaluate emerging technologies and accelerate adoption of new solutions.
• Drive joint development programs, beta-site evaluations, and customer collaborations focused on next-generation advanced packaging technologies.
• Represent Applied Materials at executive-level customer engagements, delivering technical presentations and influencing technology decisions at senior management levels.
• Capture and communicate customer insights, best practices, and lessons learned globally to strengthen product offerings and enhance customer success.
• Stay current with industry trends, technology roadmaps, and academic developments in advanced packaging, and contribute to industry conferences, technical publications, and professional forums.

• PhD, Master's, or Bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related discipline.
• 15+ years of semiconductor industry experience with deep expertise in advanced packaging process development, process integration, customer engineering, or technology pathfinding.
• Strong knowledge of packaging technologies such as Fan-Out, CoWoS, 2.5D/3D integration, RDL, TSV, hybrid bonding, electroplating, CMP, wafer-level processing, and heterogeneous integration.
• Demonstrated expertise in DOE, statistical process control, failure analysis, root cause investigation, and yield improvement.
• Experience working directly with leading foundries, OSATs, IDMs, or semiconductor equipment suppliers.
• Proven ability to influence customers and stakeholders across technical and executive levels.
• Strong leadership, communication, and cross-functional collaboration skills in a global environment.
• Experience leading strategic customer engagements, joint development programs, or technology commercialization initiatives is highly desirable.

• Woodlands office