Director, Module Process Engineer

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Location:
Icheon-Gwango,KOR

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

• Customer HVP and service opportunity identification
• Engages with customers to understand customer roadmap, interpret the technology and service needs and identify opportunities for Applied service engagement. Identify customer high value problems. Adaption and introduction of new AGS service solutions.
• Works with service business unit (SBU) and service products development (SPD) team in service product development and transfer to customers including on-site optimization. Capture and feedback service learnings to SBU and SPD.
• Serves as liaison between the customer and the SBU/SPD, ensuring clear understanding of customer issues and delivery of applicable service solutions
• Works closely with customer and FSO team to meet CSA performance KPIs
• Resolve complex tool issues utilizing systematic troubleshooting methodology (DOEs, FDC, Analytics, etc.).Communicate learnings to rest-of-world to strengthen service product packages.
• Advanced Integration, FDC, Analytics, metrology knowledge

• In depth knowledge of hardware and processes on Packaging
• Regarded as the technical expert in their particular field
• Demonstrates in-depth and/or breadth of expertise in own discipline and broad knowledge of other disciplines within the function
• Advanced integration knowledge is a plus
• BS Degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics or Chemistry. Advanced degree in these fields is preferred.