Module Process Development Engineer

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Apple is looking for a highly motivated process development engineer to join Display Technologies Organization, Panel Process and Optics (PPO) Engineering team, to work on optical module process development. The engineer will be working in a highly-technical and fast-paced team, tackling sophisticated product design challenges. The candidate is expected to work efficiently to design new process architectures, customize and bring up new equipment, design DOE and drive optimization, own failure analysis and summarize data, communicate and report to cross-functional collaborators and management. The candidate is expected to have multidisciplinary skillsets, solid process fundamentals, and strength in equipment design and hardware/software system integration.

Description

Lead new equipment and process development for electrical/optical modules.

Convert incubation technologies and proof-of-concept equipment and process into scalable and executable solutions, and validate them through module process optimizations and builds.

Work closely and collaboratively with cross-functional team members, internal labs and external vendors to define, design, modify, test, and qualify equipment hardware and software

Be responsible for DOE planning empirical trials, theoretical analysis, characterization, data analysis and visualization, parameter optimization, documentation, sharing and reporting results.

Lead communication with cross-functional team and executives in a timely fashion.

Keep tabs on relevant industrial equipment and process manufacturing technology trends. Evaluate and assess new EQ suppliers

About 10-20% international travel to work with vendors in factories

Preferred Qualifications

Ph.D. degree in relevant field.

Broad knowledge in interconnect and laser bonding.

Experience in equipment design

Strong record in process or equipment innovations for mass production products.

Willing to work in a fast paced project with dynamic changes of project priority and technical directions.

Minimum Qualifications

B.S. degree in opto-mechanics, mechatronics, robotics, or mechanical engineering or related, with minimum of 3 years of direct experience in process and equipment development for electrical or optical products.

Experience in process fundamentals including electrical interconnect (soldering, SMT, TCB), laser bonding(LAB), flip-chip bonding, advanced semiconductor packaging, PnP precision alignment, and assembly, etc.

Experience in designing, building, and operating high-precision bonding/assembly equipment or laser equipment.

Experience in equipment automation, cycle time optimization and line balancing, efficiency projection and validation, in-process quality control with metrology and testing.

Experience 3D CAD (e.g. NX, Solidworks), control systems and software interface (e.g. Labview, Python), mechatronics and robotics, and data analysis tools (e.g. Matlab, JMP).

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