Senior Staff Engineer - Multiphysics

Date posted 06/07/2026
Category Engineering Hire Type Employee Job ID 17677 Date Posted 06/07/2026

We Are

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You Are

You have spent years living in the space where physics meets silicon, where a thermal hotspot can kill a chiplet design and an EM violation three months before tapeout becomes everyone's problem. You know that multiphysics simulation is not just about running tools, it is about understanding how electrical, thermal, mechanical, and electromagnetic phenomena interact in ways that break assumptions and require real engineering judgment. You have been in the room when a customer's advanced packaging design hit a wall, and you were the one who figured out whether it was a modeling issue, a flow gap, or a fundamental design tradeoff that no tool could solve alone.

You do not wait for perfect documentation or clean handoffs. You dig into Tcl scripts, Python automation, and tool internals when the flow does not do what it needs to do. You have worked closely enough with R&D to know what is a feature request and what is a workaround you can build today. You are comfortable presenting technical results to leading semiconductor customers who will ask hard questions, and you can translate their production challenges into roadmap priorities that R&D can actually act on.

At Synopsys, you will be at the center of integrating Ansys multiphysics technologies with our EDA signoff portfolio, working on 3DIC, HBM, and chiplet designs that power the next generation of AI and HPC systems.

What You'll Be Doing

• Deploy and enable RedHawk-SC, RedHawk-SC ET, Totem-SC, HFSS, and HFSS-PI at key Korean semiconductor and foundry customers, driving production adoption of unified multiphysics-aware signoff flows
• Build and validate end-to-end flows that integrate Synopsys EDA tools like Fusion Compiler, StarRC, PrimeTime, and PrimePower with Ansys multiphysics platforms for electrical, thermal, mechanical, and EM co-analysis
• Provide hands-on technical support for advanced packaging, 3DIC, HBM5, and chiplet interconnect designs, working directly with customer engineering teams to solve real tapeout challenges
• Develop production-grade reference flows and benchmarks that demonstrate measurable improvements in turnaround time, accuracy, and design closure efficiency across HBM, 3DIC, and UCIe architectures
• Translate customer requirements and production roadblocks into actionable R&D feedback, working with global Signoff and 3DIC engineering teams to prioritize roadmap alignment
• Automate workflows using Tcl and Python to enable seamless integration between multiphysics simulation and physical design signoff environments
• Represent Synopsys in technical reviews, proof-of-concept engagements, and customer-facing presentations, articulating the combined value of Synopsys and Ansys solutions in Korean and English

• Enable leading Korean semiconductor companies to adopt multiphysics-aware signoff flows that reduce design iterations and catch critical failures earlier in 3DIC and advanced packaging designs
• Accelerate time-to-production for HBM5, chiplet, and AI/HPC system designs by delivering integrated electrical, thermal, and EM analysis capabilities that work together instead of in silos
• Shape the Synopsys-Ansys product roadmap by channeling real customer pain points into prioritized R&D initiatives that drive GPU acceleration, AI-driven optimization, and tighter EDA-multiphysics integration
• Build reusable methodologies and reference flows that scale across Synopsys customer base, turning one-off solutions into repeatable best practices
• Strengthen Synopsys relationships with key semiconductor and foundry customers by being the engineer they trust to solve hard problems when standard flows are not enough
• Prove out the technical and business value of the Synopsys-Ansys integration in production environments, directly influencing adoption and expansion across the semiconductor ecosystem
• Help bridge the gap between signoff and system-level analysis, enabling customers to co-optimize chip and package performance in ways that were not possible before

• MS or PhD in Electrical Engineering, Mechanical Engineering, Applied Physics, Computational Science, or related field, or Bachelor's degree with equivalent industry depth
• 8+ years of hands-on experience in multiphysics simulation (EM, thermal, mechanical, fluid, or coupled-domain), semiconductor signoff (IR-drop, EM, SI/PI, thermal), or advanced packaging and 3DIC design and analysis
• Direct experience with tools like Ansys HFSS, RedHawk-SC, Icepak, Fluent, or Synopsys RedHawk-SC ET in production or customer-facing environments
• Solid understanding of signoff flows and physical design fundamentals, including how IR-drop, electromigration, and thermal analysis tie into tapeout decisions
• Proficiency in Tcl and Python for flow automation, scripting, and tool integration
• Fluency in Korean and English for customer-facing technical communication and cross-functional collaboration with global teams
• Experience with GPU-accelerated simulation, AI-driven optimization, or chiplet interconnect standards like UCIe is a strong plus

• You can walk into a customer meeting with incomplete data, ask the right diagnostic questions, and leave with a clear action plan that moves the engagement forward
• You have debugged enough multiphysics simulations to know when a result is wrong before you even look at the log file, and you can explain the failure mode to someone who has never run the tool
• You are comfortable operating independently in a customer site in Korea while staying tightly aligned with R&D teams in the global R&D across time zones
• You can explain a complex electrothermal tradeoff to a design lead in two sentences without losing the technical nuance, and you know when to escalate versus when to solve it yourself
• You take ownership of customer success, if a flow is not working in production, you do not wait for someone else to fix it, you dig in, build the workaround, and document it so the next engineer does not hit the same wall
• You have a point of view on what good multiphysics-aware signoff looks like, and you push back when a proposed flow is too fragile, too slow, or missing a critical physics interaction