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Apple's Hardware Technology group is seeking an experienced Display Opto-Mechanical Engineer to support the development, integration, and qualification of next-generation display modules and future technologies. In this role, you will collaborate closely with internal engineering teams and manufacturing partners, focusing on module integration spanning optics, display systems, and opto-mechanical assembly to help bring innovative hardware designs into high-volume production.

Description
As a Display Opto-Mechanical Engineer, you will drive the integration, validation, and yield maturity of cutting-edge display modules across development builds through mass production. You will serve as a key technical partner with suppliers and cross-functional teams, solving complex opto-mechanical challenges at the interface of panels, optical stacks, and structural enclosures. Through rigorous data analysis, hands-on failure analysis, and on-site vendor engagement, you will ensure our displays meet Apple's exacting standards for optical performance and product reliability.","responsibilities":"Display Module & Integration: Lead module-level integration across the display panel, optical stack layers, adhesives, and mechanical housing. Optimize interface robustness against interfacial shear, CTE mismatch, warpage, and lamination defects. Drive opto-mechanical assembly process development and optimization with vendors to establish stable, high-yielding integration processes.
FOS Evaluation & Optical Defect Analysis: Own on-site front-of-screen (FOS) optical evaluations, establish boundary samples and defect criteria across build phases. Lead end-to-end failure analysis on optical anomalies, cosmetic fallout, and display performance shifts induced by module assembly and system integration. Review build data to identify issues and drive corrective actions to improve yield and performance.
Supplier Technical Management & Quality Closed-Loop: Serve as Apple's primary in-region technical representative at display and module assembly vendors, owning day-to-day engineering communication and issue resolution. Direct module vendors and contract manufacturers on critical process parameters, DOE execution, and inline inspection metrology. Lead technical audits and enforce rigorous 8D/CAR corrective actions to drive yield and reliability maturity.
Validation & New Technology Readiness: Plan and execute validation exercises to demonstrate initial feasibility, design robustness, and manufacturing capability for new display modules. Support new technology investigations, evaluating vendor readiness and process maturity for emerging display and optical technologies.
Communication & Coordination: Communicate technical status, risks, and recommendations clearly and regularly to Apple's engineering and program management teams. Lead technical alignment between display component vendors, optical module makers, and system assembly integrators.

Preferred Qualifications
Master's degree or Ph.D. in Physics, Optics, Electrical Engineering, Mechanical Engineering, or related technical field with 2+ years of relevant experience.
Fluency in Korean to support effective technical collaboration with regional partners and vendors.
Experience with new technology development and transfer to mass production, including process characterization and yield improvement
Proficiency with design of experiments (DOE), FMEA, design for manufacturability (DFM), and reliability engineering methodologies
Prior experience working within the Apple supply chain or in the consumer electronics field

Minimum Qualifications
Bachelor's degree in Physics, Optics, Electrical Engineering, Mechanical Engineering, or equivalent practical experience.
5+ years of hands-on experience in display module architecture, optical stack integration, and system-level hardware implementation for high-volume consumer products.
Optical & Front-of-Screen Expertise: Solid knowledge of display optical characterization and FOS metrics. Familiarity with micro-optics or diffractive optical elements, wave-optics principles, and the optical impacts of mechanical and thermal stress on fine-pitch structures
Module Process & Bonding Interfaces: Familiarity with precision assembly processes such as OCA/OCR optical lamination, active alignment, structural bonding, adhesive dispensing/curing, and fine-pitch interconnects (FPC/ACF). Understanding of interface failure modes including delamination, voiding/bubbles, warpage, and micro-cracks
Reliability & Failure Analysis: Working understanding of key environmental and mechanical reliability stresses (thermal shock, dynamic fatigue, impact/drop). Proficient in orchestrating FA using optical microscopy, cross-sectioning, SEM/EDX, CT/X-ray, and surface profilometry to trace assembly defects to root causes
Vendor Collaboration & Technical Management: Proven experience directing component suppliers, module integrators, and contract manufacturers. Ability to audit vendor processes, drive supplier-side DOEs, and enforce stringent quality and process controls
Excellent written and verbal communication skills in English, with the ability to clearly articulate technical issues and recommendations to both internal teams and external vendors
Able to travel domestically and/or internationally as required to support vendor engagements and build activities

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