Packaging Assembly Engineer
Aug 4, 2026 Seoul, South Korea
About us
Working at Apple means doing more than you ever thought possible and having more impact than you ever imagined.
- Size: 10,000+ employees
- Industry: Technology
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.
Description
Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.","responsibilities":"Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
Plan and execute DOEs to improve yield, quality, and cost; analyze data using SPC and other statistical tools, and drive closure on findings.
Lead root-cause analysis and corrective actions for assembly excursions, yield issues, and customer returns, in collaboration with quality, reliability, and FA teams.
Partner with substrate and package design teams to provide DFM input on pad/bump design, stack-up, warpage control, and assembly design rules for FCBGA packages.
Support NPI builds and ramp at OSAT sites: process window definition, buy-off criteria, and transfer to volume manufacturing.
Drive continuous improvement projects for cycle time, throughput, equipment uptime, and cost reduction while maintaining quality and reliability targets.
Interface with equipment and materials suppliers to evaluate new tools, materials (underfill, solder, flux, lid attach, etc.), and technologies relevant to FCBGA assembly.
Preferred Qualifications
None
Minimum Qualifications
5+ years of extensive experience in Semiconductor Packaging field.
Working knowledge in materials characterization and analysis.
Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology.
General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
Ability to work independently and take on projects with minimum supervision.
Good engineering problem solving skills with strong engineering physics and fundamentals.
Can use package design softwares, APD, Virtuoso, etc.
Working knowledge in memory packaging.
Good program management skill.
M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field desired.
Description
Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.","responsibilities":"Define and optimize end-to-end FCBGA assembly process flow (wafer back-end interface, flip-chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
Plan and execute DOEs to improve yield, quality, and cost; analyze data using SPC and other statistical tools, and drive closure on findings.
Lead root-cause analysis and corrective actions for assembly excursions, yield issues, and customer returns, in collaboration with quality, reliability, and FA teams.
Partner with substrate and package design teams to provide DFM input on pad/bump design, stack-up, warpage control, and assembly design rules for FCBGA packages.
Support NPI builds and ramp at OSAT sites: process window definition, buy-off criteria, and transfer to volume manufacturing.
Drive continuous improvement projects for cycle time, throughput, equipment uptime, and cost reduction while maintaining quality and reliability targets.
Interface with equipment and materials suppliers to evaluate new tools, materials (underfill, solder, flux, lid attach, etc.), and technologies relevant to FCBGA assembly.
Preferred Qualifications
None
Minimum Qualifications
5+ years of extensive experience in Semiconductor Packaging field.
Working knowledge in materials characterization and analysis.
Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology.
General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
Ability to work independently and take on projects with minimum supervision.
Good engineering problem solving skills with strong engineering physics and fundamentals.
Can use package design softwares, APD, Virtuoso, etc.
Working knowledge in memory packaging.
Good program management skill.
M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field desired.
Additional Information
- Posted: Aug 4, 2026