Senior Process Engineer

Sr Process Engineer

The process engineer will develop BEOL silicon processing for applications in wafer and die bonding applications to develop ZiBond and DBI technology. The successful candidate will:

  • Work closely with the team to develop the clean room processes required to drive high yielding BEOL silicon processes with our vendor partners.
  • Participate in tech transfer process by working side by side with partners to bring up their Zibond and DBI process. Interface with silicon suppliers to ensure calibration of process and metrology tools.
  • You will work closely with our engineering team and tool vendors to ensure successful tech transfer from prototype to manufacturing. Work closely with engineering team to execute DOEs according to the agreed upon plan. Develop new unit processes to meet the needs of the program.

 Minimum Requirements:

  • PhD in Materials Science, Chemical or Electrical Engineering + 2 years of experience.
  • MS in Materials Science or Chemical Engineering + 5 years of experience.
  • Hands on experience in silicon process or wafer processing technology:
    • Silicon processing includes experience in several of the following areas:
      • Wafer cleaning protocols
      • Thin film deposition
      • Plasma processes (etch or deposition)
      • Photolithography
    • Experience in characterization techniques: optical microscopy, SEM, EDS, AFM, elipsometry, CSAM.
    • Statistical analysis and DOE generation
  • Willing to travel up to 25% of the time to customer sites for collaboration project management Technical individual with excellent written and verbal communication skills. Works with teammates at various experience levels (technician and engineer).
  • Self-starter who can drive technical tasks to conclusion with a clear analytical summary.
  • Demonstrated ability to work well in a team and incorporate key ideas to obtain results.

Additional Experience a Plus:

  • Demonstrated success solving equipment related problems in a timely manner. Comfortable problem solving equipment related failures and involving vendors where appropriate.
  • Experience with chemical mechanical polishing and bonding at the wafer and/or die level.



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