Process Integration Engineer 3/4

Northrop Grumman Mission Systems seeks to fill two Process Integration Engineer 3/4 positions within our Advanced Technology Lab (ATL). ATL is located just outside of Baltimore, MD - where we design, manufacture, and test semiconductor products for internal and commercial production as well as emerging programs. We have over 21,000 square feet of Class 100 wafer fabrication cleanroom that supports variants of Si; SiGe; GaAs; SiC.
At Northrop Grumman's Advanced Technology Lab VARIETY describes the work that our process integration team enjoys. The process integration team at ATL has the chance to work on both production and development programs, as well as troubleshooting and process improvements. Many people on our process integration team work on more than one product/program at once, and have exposure to other products as well. The process integration group is also an integral part of the foundry process, interfacing with multiple other foundry groups on a daily basis.

Roles and Responsibilities:

The Process Integration Engineer 3/4 (First Shift) will be responsible for the development and qualification of new devices and the creation of integrated processes supporting several technologies including CMOS, BiCMOS,
compound semiconductors, and novel materials. Candidate should have in-depth knowledge of semiconductor processing and wafer fabrication with some device knowledge. Duties include defining device structures for product monitoring,
process continuous improvement, design and evaluation of experiments, electrical and functional parts evaluation, and products qualification. Candidate should have the ability to develop advanced technological ideas and guide their development to a final product.

Join us for the chance to work with an amazing, experienced, and talented team. We are expanding with new work on many development and production programs.
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This requisition may be filled as a level 3 or a level 4 based on the qualifications below.

Basic Qualifications for level 3: - Bachelor's Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 5 years of relevant experience (3 years with an MS or 0 years with PhD)
-In-depth knowledge of semiconductor processing and wafer fabrication with some device knowledge.
- Must be able to obtain and maintain a secret security clearance (US Citizenship is a requirement for this).

Basic Qualifications for level 4:
- Bachelor's Degree in Engineering, Microelectronics, Material Science, Chemistry, Physics or closely related technical major with 9 years of relevant experience (7 years with an MS or 4 with a PhD)
-In-depth knowledge of semiconductor processing and wafer fabrication with some device knowledge.
- Must be able to obtain and maintain a secret security clearance (US Citizenship is a requirement for this).

Preferred Qualifications:
- Course work in semiconductor processing, analog and microwave electronic circuits
- III-V semiconductor fabrication experience
- RF test analysis and production engineering experience
- Experience with DOEs, JMP, statistical analysis

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.${descr2}${descr3}


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