Mechanical Engineer, Microelectronics Packaging Design 3/4



Northrop Grumman is seeking a Mechanical Engineer 3/4 to join our team of qualified, diverse individuals. This position will be located in Baltimore, MD.

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems in air and space that impact people's lives around the world today, and for generations to come. Our work preserves freedom and democracy, and advances human discovery and our understanding of the universe. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have a lot of fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Interested in growing your mechanical engineering skills in the art of microelectronics packaging design? This team is where technology and teamwork come together to design state of the art highly integrated microelectronics for our warfighters. The qualified applicant will become part of Northrop Grumman's cutting edge microelectronics packaging design team, and help to provide core enabling technology elements to our advanced apertures/sub-systems, sensors and mission systems.

Roles and Responsibilities:

  • Designing cutting edge analog and digital microelectronics solutions, utilizing multiple chip-scale packaging technologies including ceramic, organic, MCM, IMA, QFN, BGA, 3DI, Flip Chip and antenna tiles to support sub-system requirements
  • Interfacing with electrical design counterparts, chip designers, thermal and structural analysts, and manufacturing teams throughout the design phase
  • Coordinating with drafting, manufacturing, and supply chain teams to provide consultation as needed for successful fabrication and delivery of completed products
  • Supporting development of analysis/testing of delivered products for design verification to ensure a smooth transition into production
This is a Dual Level position and candidates will be considered for both levels according to the basic qualifications listed below.

Basic Qualifications for a Level 3:

To be considered for this position, you must minimally meet the knowledge, skills, and abilities listed below:
  • Bachelors in an engineering or science discipline
  • 5 years of experience in microelectronics packaging design or related area or 3 years of experience with a M.S Degree in engineering or science discipline.
  • Experience designing microelectronic packages in organic and/or ceramic mediums
  • Must be able to obtain a Secret Clearance
Basic Qualifications for a Level 4:
To be considered for this position, you must minimally meet the knowledge, skills, and abilities listed below:
  • Bachelors in an engineering or science discipline
  • 9 years of experience in microelectronics packaging design or related area or 7 years of experience with a M.S. Degree in engineering or science discipline.
  • Experience designing microelectronic packages in organic and/or ceramic mediums
  • Must be able to obtain a Secret Clearance
Preferred Qualifications:

Candidates with these desired skills will be given preferential consideration:
  • Experience with AutoCAD
  • Experience with NX or other 3D modeling software
  • Active DOD Secret Clearance
  • Experience with chip-scale packaging
  • Familiar with Printed Wiring Board (PWB) design and fabrication


Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.


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