Mechanical Engineer 3/4 - Printed Wiring Boards

Northrop Grumman Mission Systems is seeking an experienced engineer or technical professional to be a member of a team dedicated to the design and fabrication of state of the art Printed Wiring Boards and be an advocate for new PWB Technology insertion.

Candidate must have a working knowledge of Microwave Printed Circuit Board, Rigid PWB, High Density PWB, Flex, and Rigid Flex fabrication and/or design.

This position entails coordinating customer contractual requirements, supplier capabilities, and design constraints to produce high yield functional hardware.

As a member of the team, the individual will be tasked to drive commonality across all programs and product lines, review and verify all new PWB designs, travel to board suppliers, develop alternate board materials and adhesives, insert new technology and sign-off on all PWB related drawings and supporting documentation.

This position can be hired at either a Band 3 or Band 4 Level. The qualifications for each level are listed below.

Basic Qualifications for a Band 3:

  • B.S. Degree in engineering, mathematics, or physical science with a minimum of 5 years relevant work experience or a Master’s Degree with 3 years relevant experience.
  • Solid experience in printed circuit board design and/or fabrication techniques.
  • Good Verbal, Writing and Communication Skills
  • Must have the ability to obtain a TS/SCI security clearance (U.S. Citizenship is a Pre-requisite).

Basic Qualifications for a Band 4:

  • B.S. Degree in engineering, mathematics, or physical science with a minimum of 9 years relevant work experience or a Master’s Degree with 7 years relevant experience.
  • Solid experience in printed circuit board design and/or fabrication techniques.
  • Good Verbal, Writing and Communication Skills
  • Must have the ability to obtain a TS/SCI security clearance (U.S. Citizenship is a Pre-requisite).

Preferred Qualifications for both Band Levels:

  • Active secret clearance
  • Working knowledge of NX (or equivalent 3D CAD package)
  • Broad knowledge of available board materials, platings, etching techniques, lamination processes, bonding films, embedded resistors, drilling and PTH VIA formation and PWB assembly techniques.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.


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