Requirements:

• Design and develop new and existing products and processes related to the packaging of high-powered laser diode bars
• Transition new products and processes to a production environment
• Provide support and training to production personnel on new and existing products and processes
• Interface with customers and vendors to create custom laser diode packaging solutions to meet specific customer needs
• Independently design, conduct, analyze, and report on experiments

• Bachelor's degree in Physics, Electrical Engineering, or Material Science
• 3+ years of experience in semiconductor laser packaging or related field
• Experience with a variety of materials related to semiconductor packaging (high thermal conductivity materials, composite materials, etc.)
• Experience with die attach processes (eutectic die-bonders, reflow ovens, vacuum soldering, etc.)
• Familiarity with a variety of manufacturing and statistical tools (DOE, SPC, Minitab, WinSPC, etc.)
• A strong background in industry or manufacturing, including an understanding of Design of Experiments methodologies and Statistical Process Control

• Master's degree in Physics, Electrical Engineering, or Material Science
• 5+ years of experience in semiconductor laser packaging or related field
• Programming experience with LabVIEW and/or Python
• Experience with the materials and processes used in high-powered semiconductor device packaging
• Experience characterizing the performance laser diode bar