Manufacturing Engineer / Goleta, CA

Description:Job Description
This position reports to the Santa Barbara Focalplane facility in Goleta, CA to support second shift Cryogenic Dewar Focal Plane Array Packaging.

Seeking a candidate to work in a team environment to develop, qualify, implement, and sustain new and legacy Integrated Detector Cooler Assembly (IDCA) processes. In a multidisciplinary role, the process engineer is responsible for performing engineering experiments, implementing process changes, introduction and sustaining of processes and equipment in coordination with production, design and quality including methodical troubleshooting of process issues. The successful candidate will demonstrate the ability to work independently in an industrial environment. Desirable skills include experience with hermetic packaging and machine automation.

Relocation: Relocation assistance is possible for this exciting position.

The Locale: Goleta is a city in southern Santa Barbara County, California. Goleta is part of the central coast region of California and offers lots of great scenery and is a great place to live and to raise a family. The region is known primarily for agriculture and tourism. Major crops include wine grapes, lettuce, strawberries, and artichokes. Goleta is known for being near the University of California, Santa Barbara campus, although the CDP of Isla Vista is closer.
Goleta is about 8 miles west of the city of Santa Barbara, along the coast (the coast runs east to west in this portion of southern California).

MFCREFER-SANTABARBARA
MFCPO
Basic Qualifications:
B.S. degree with a minimum of 4 years practical experience.

The position requires working knowledge in automated assembly processes.

Experience in semiconductor packaging and/or processing, in industry environment.

Must be proficient in MS Office (Word, PowerPoint, Excel), familiar with DOE analysis, SPC, and have excellent engineering documentation skills and communication skills.

Must have the ability to obtain a security clearance and therefore must be a U.S. Citizen.
Desired Skills:
M.S. degree with a minimum of 3 years practical experience.

Experience with high volume semiconductor packaging processes. IR industry experience is beneficial.
Knowledge of common IR manufacturing processes such as: laser welding, adhesive component attach, wirebonding, vacuum ovens, and plasma processes.
Familiarity with MATLAB and JMP or other data analysis software. Demonstrated ability to lead teams on complex projects.
Ability to interface effectively from the technician level to senior management.
BASIC QUALIFICATIONS:
B.S. degree with a minimum of 4 years practical experience.

The position requires working knowledge in automated assembly processes.

Experience in semiconductor packaging and/or processing, in industry environment.

Must be proficient in MS Office (Word, PowerPoint, Excel), familiar with DOE analysis, SPC, and have excellent engineering documentation skills and communication skills.

Must have the ability to obtain a security clearance and therefore must be a U.S. Citizen.
Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
As a leading technology innovation company, Lockheed Martin's vast team works with partners around the world to bring proven performance to our customers' toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories.

Join us at Lockheed Martin, where we're engineering a better tomorrow.


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