Assembler/ Wire Bonder

Description:Wirebonding Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 mil
Basic Qualifications:
Ability to work under a microscope for 10 hours a day
Good dexterity
Ability to follow procedures, drawings and wire bond patterns
Ability to efficiently use a computer for all daily assembly purposes
Ability to work in a team environment
Must be able to attain a Secret level clearance
Desired Skills:
6 months or more wire bond experience or training certificate in wire bonding
BASIC QUALIFICATIONS:
Ability to work under a microscope for 10 hours a day
Good dexterity
Ability to follow procedures, drawings and wire bond patterns
Ability to efficiently use a computer for all daily assembly purposes
Ability to work in a team environment
Must be able to attain a Secret level clearance
Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
As a leading technology innovation company, Lockheed Martin's vast team works with partners around the world to bring proven performance to our customers' toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories.

Join us at Lockheed Martin, where we're engineering a better tomorrow.


Back to top