Assembler/ Wire Bonder

Description:Wirebonding Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 mil, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual screening, wirebonds or chip placement. Perform wire and ribbon bonding to duroid, ceramic, capacitors, resistors, diodes, and spirals. Duties include installation of substrates and components in highly complex microwave assemblies, wire bonding using manual .001 and .0007 machines, and substrate and component attachment using paste and sheet epoxies. Experience using Westbond and Metcal bonding machines and Unitech welder prefered. Defense industry experience; familiarity with ESD & FOD protection requirements; ability to work from detailed process sheets and drawings, work under a microscope, and use hand tools; good hand/eye coordination and computer skills are required. Ability to perform tasks with little to no direction and ability to put forth process improvement ideas based on experience and job knowledge. Ability to guide others with less experience and develop lower level employees skill sets
Basic Qualifications:
Assembly; Strong Wirebond skills including but not limited to Gold wire bonding of wires down to .0007 inches in diameter. Ribbon bonding and welding of various sizes and on various material; Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities. Ability to read and work from detailed process sheets and drawings. Good communication, interpersonal and teaming skills; ability to interact effectively with teammates and management. Ability to work under a microscope for 10 hours a shift, and use hand tools.

Candidate must be able to obtain a Secret Security Clearance and must have at least an Interim Secret Security clearance prior to start.
Desired Skills:
Wirebond to .001 mil and .0007 mil, ribbon bond, substrate and component attach, auto pick-and-place, familiarity with ESD and FOD. Experience with torque wrench/driver. Experience operating autobonder; various mechanical assembly processes. Autobond Assembly. Defense experiance / familiarity with ISO 9001 AS9100. Mil STD 883
BASIC QUALIFICATIONS:
Assembly; Strong Wirebond skills including but not limited to Gold wire bonding of wires down to .0007 inches in diameter. Ribbon bonding and welding of various sizes and on various material; Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities. Ability to read and work from detailed process sheets and drawings. Good communication, interpersonal and teaming skills; ability to interact effectively with teammates and management. Ability to work under a microscope for 10 hours a shift, and use hand tools.

Candidate must be able to obtain a Secret Security Clearance and must have at least an Interim Secret Security clearance prior to start.
Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
As a leading technology innovation company, Lockheed Martin's vast team works with partners around the world to bring proven performance to our customers' toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories.

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