Sr. Flip chip Packaging Substrate Engineer

Responsibilities

Kforce has a client, a growing and established company in the state of Arizona is seeking a Senior Flip Chip Packaging Engineer in the Phoenix, AZ metro area with solid substrate experience. We are looking for candidates nationwide willing to relocate to the Phoenix area. A relocation is provided. We are working directly with the Hiring Manager.Essential Duties:

• Direct interface with suppliers and factory engineers for new substrate development and qualification
• position includes cross functional management and direct customer interactions for new product development, qualification and mass production of advanced flip chip products
• Duties include the daily application of detailed knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development/NPI programs
• Driving customer requirements and timelines to multiple factories; Deep diving into root cause failure analysis and clearing obstacles with product design, reliability, and manufacturability issues; Performing and analyzing detailed cost modeling for providing product level assembly pricing
• Chosen candidate will be responsible for driving cost reductions and increased revenues within assigned customer base
• This role combines deep technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill
• The chosen individual will need to help define and concurrently manage ownership of multiple programs, from both the business
• Responsibility for substrate technology path finding and roadmap execution
• Work closely with suppliers to identify capabilities and capacities for all key processes and material sets (ABF, uBall, stacked vias, Coreless, etc.)
• Drive substrate suppliers to meet technology requirements and timelines
• Work across different functional groups and involvement with engineering, product development, etc.

• BS or MS Mechanical, Chemical, Materials or Electrical Engineering
• 8-12+ years of experience in the semiconductor industry
• Experience with substrate technology path finding and roadmap execution
• Experience working with substrates
• Experience interfacing with suppliers and factory engineers for new substrate development and qualifications
• Strong experience and knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various flip chip package form factors
• Strong project management experience
• Excellent technical project management experience (preferably, involving offshore factories) and the ability to manage numerous programs and teams is required
• Demonstrated ability to work independently
• Strong ability to overcome obstacles and assume ownership of program success a must
• Strong experience and knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various flip chip package form factors
• Excellent written and verbal communication skills a must
• Ability and willingness to travel both domestic and internationally about 30% a must
• Hands on manufacturing/technical experience highly desired
• PMP certification a plus
• Experience with cost modeling, pricing, quoting activities and products desired
• Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures desired
• Experience/knowledge of flip chip packaging failure analysis methods also desired
• Familiarity with Design of Experiments and Statistical Process Control (JMP) a plus