Senior Electronics Packaging Engineer

The Johns Hopkins University Applied Physics Laboratory (APL) is a national leader in scientific research and development and is located midway between Baltimore and Washington, DC. The Applied Physics Laboratory is actively seeking a Senior Electronics Packaging Engineer.

Job Summary:

Perform electronics packaging in support of a diverse set of engineering challenges, applying both mechanical design and finite element analysis skills in the process.

Duties

1.Review the electronics packaging aspects of space and military hardware as it goes from development, to qualification, and ultimately production.(50%)

2.Perform various types of mechanical analysis (thermal, structural, vibration, shock, etc.) on a variety of engineering systems, both mechanical and electromechanical. (20%)

3.Develop mechanical solutions including conceptual design, detailed design, and fabrication drawings, all the while keeping in mind design for manufacturability and assembly. (20%)

4.Prepare presentation materials and brief sponsors and customers on ongoing mechanical efforts. (10%)

Note:

This job summary and listing of duties is for the purpose of describing the position and its essential functions at time of hire and may change over time.

Required Qualifications:

  • BSME with 5 years of experience in mechanical packaging of electronics equipment for military and/or space applications .
  • Familiarity with printed wiring board (PWB) fabrication, electronics assembly, connector selection and cable design.
  • Experience in dealing with production issues and qualification failures as they arise.
  • The ability to review qualification failures and production issues and present an assessment of the issue to the sponsor.
  • Experience performing mechanical analysis including structural, thermal and vibration.
  • Strong communications and interpersonal skills working with multi-disciplines team.
  • Ability to obtain a Secret clearance.

Desired Qualifications:

  • MSME with 10 years experience in mechanical packaging of electronics equipment.
  • Proficient in computer-aided design (CAD) using Creo, or Solidworks, or both.
  • Finite element analysis experience in either ANSYS or LS-DYNA.

Special Working Conditions:

Local and domestic travel to sponsors, government laboratories. Occasional evening hours to support conference calls on west coast time.

Security:

Applicant selected will be subject to a government security clearance investigation and must meet the requirements for access to classified information. Eligibility requirements include U.S. citizenship.

Benefits:

APL offers a comprehensive benefits package including a liberal vacation plan, a matching retirement program, significant educational assistance, a scholarship tuition program for staff with dependents, and competitive salaries commensurate with skills and experience. For more information about our organization, please visit our web site at www.jhuapl.edu.

Equal Employment Opportunity:

Johns Hopkins University/Applied Physics Laboratory (APL) is an Equal Opportunity/Affirmative Action employer that complies with Title IX of the Education Amendments Acts of 1972, as well as other applicable laws. All qualified applicants will receive consideration for employment without regard to race, color, religion, sexual orientation, gender identity, national origin, disability, or protected Veteran status.


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