TD Diff-IMP Eningeer
- Dalian, China
Intel Dalian is rapidly expanding its 3D NAND high volume manufacturing (HVM) facility, while starting-up a new Dalian Technology Development (DTD) organization to develop future generations of 3D NAND process technologies. We are seeking for strong candidates to join us as a TD Module & Integration Yield Engineer in the Diffusion and Implant Technology Development (TD) Department of DTD, covering LPCVD, ALD, oxidation, implant, thermal & plasma treatments processes on batch, mini-batch or single wafer platforms.The selected candidates will be responsible for activities covering process, equipment, materials, and operations. Examples of scope of work include silicon process improvement and product enhancement, equipment capability evaluation and expansion, and wafer cost reduction.Candidates must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization.The ideal successful candidate will:? Demonstrate an in-depth knowledge of DIFFUSION/IMPLANT fundamentals including deposition techniques, plasma physics and thermal treatments.Perform feasibility study and provide module level process solutions to meet desired device specification and process improvement requirements? Lead new process experimentation, implementation and high volume manufacturing readiness in the area of expertise.? Define, select and qualify the equipment platforms to meet quality and output needs of new processes for HVM ramp and transfer the technology to HVM counterpart? Install and qualify first of a kind of tools (FOAK) for TD and audit installation/qualification and train HVM teams and lead tool release to support HVM ramp? Collaborate with HVM teams on continued improvement programs (CIP) for established processes.Develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.Develop strategy to resolve difficult problems and establish systems to deal with these problems in the future.Additional Requirements: Engage closely with tool vendors. Drive escalations and ensure resolution to any process and/or equipment problems.Drive improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables.Familiar with multiple characterization techniques including, but not limited to, XSEM, TEM, STEM, XPS, VPD, TXRF, and EELS.Must be flexible in accommodating changing priorities and working hours to support business needs.Excellent communication and team building skills.
PhD in a science or engineering field or MS plus a minimum 5 years of experience in semiconductor research, development or manufacturing environment are required
Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking
Hands-on experiences in technology development, technology transfer or startup are required
Strong expertise of process characterization, qualification and troubleshooting is required
Direct experience in Silicon Process Technology Development is highly desired.
Motivated self-starter, with strong ability to work independently as well as in a team environment;
Strong verbal and written communication skills in English
Think and operate independently, while simultaneously focusing on many diverse priorities
Flexibility and maturity in facing uncertainties and changing priorities/responsibilities
Commit to aggressive goals and win with a can-do attitude
Act with velocity and a strong sense of urgency
Respect cultural diversity and sensitivity
Agility in learning, improving, and innovating
This position is associated with the sale of Intel's NAND memory and storage business to SK hynix. (You can read more about the transaction in the press release ). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel - come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell (QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK hynix.
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
CN Experienced Hire JR0142430 Dalian
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