Intel

SoC Physical Design Integration Engineer

1 month agoKulim, Malaysia

SoC Physical Design Integration Engineer

Job Description

To deliver next generation Intel SoC products with latest process technology and industrial EDA tools. Responsible for the SoC/Full Chip design verification and closure on physical structural design database. This includes developing innovative Full Chip methodology and flows to improve the cadence of the SoC design convergence in design domains such as layout, timing, clock tree, formal verification, signal integrity, power routing, bump design, reliability, power and performance.

Qualifications

  • Bachelor of Engineering degree or a Master of Science degree in Electronic, Electrical or Computer Engineering, or equivalent with preferably at least 7 years of industrial experience with solid understanding of physical design integration and industrial verification flows, RTL to GDS hands-on experience on large scale design with advance industrial process node.
  • Exhibit passions to involve in new design methodology and flow development with scripting such as TCL. Be able to develop scripts from scratch as well as to maintain or enhancing existing codes.
  • Exhibit excellent soft skills in communication and presentation will add values to enable cross collaborations with different functional teams across Intel.

Inside this Business Group

The Silicon Engineering Group is a worldwide organization focused on the development and integration of SOCs, Cores, and critical IPs that power Intel's leadership products. This business group leverages an incomparable mix of experts with different backgrounds, cultures, perspectives, and experiences to unleash the most innovative, amazing, and exciting computing experiences.

Other Locations

Malaysia, Kulim

MYExperienced HireJR0142612PenangSilicon Engineering Group

Client-provided location(s): Kulim, Kedah, Malaysia; George Town, Penang, Malaysia
Job ID: intel-JR0142612

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