As a matrix-member of the Datacenter Thermal Mechanical Components group, TMC, you will be in a position to make important contributions by leading the development of CPU, SoC & GPU enabling in support of datacenter specific mechanical solutions.
Candidate will be responsible for the development of thermal/mechanical solutions for various server, workstation, and cloud market segments, as well as working with a team of cross site architects, mechanical, thermal and electrical engineers. In this position, you will design and analyze mechanical systems, equipment and packaging. Conduct feasibility studies and testing on new and modified designs. Direct support personnel in the preparation of detailed design, design testing and prototype fabrication. Provide design information to drafting for packaging and tech marketing documentation
Candidate must have a minimum BS 8 yrs, MS 6 yrs, PhD 4 in Mechanical Engineering in the following areas: - Mechanical design experience with Creo or SolidWorks - New product development - Working with ASME Y15.4M drawing Tolerancing standards - GD&T - Statistical tolerance analysis and theoretical DPM prediction - FMEA risk assessment - Requirements management - Execution of validation test plans - Demonstrated experience in common manufacturing design processes such as: sheet metal forming, plastic injection molding, machining, die casting, cold forming, metal injection molding, etc. - Demonstrated experience leading world-wide complex product development - Strong communication and collaboration skills are required
Working knowledge or experience with the following is a plus: - Component level structural analysis - Computer layouts and basic architecture. - Fundamental heat transfer processes conduction/convection. - Material science - Project management and team leadership - CAD data management software Windchill - General lab testing procedures such as basic instrumentation, data acquisition, fixture design, data analysis JMP, etc.
Ability to travel to China on a regular basis will be required
Inside this Business Group
The Data Center Group (DCG) is at the heart of Intel's transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies-spanning software, processors, storage, I/O, and networking solutions-that fuel cloud, communications, enterprise, and government data centers around the world.
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