Job Description
Your new position is associated with the sale of Intel's NAND memory and storage business to SK hynix. (You can read more about the transaction in the press release ). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data. In your role, you will be part of a world-class team that will transition to lead the SSD business at SK hynix.
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK hynix.
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FDC (fault detection and classification) mission is to minimize product deviation and reduce process variation through early detection of tool health issues. FDC Engineer gain exposure and knowledge of many semiconductor process areas in the fab as they assist them with their process control needs. As node sizes continue to shrink and new technology types are introduced, the work they do directly affects the bottom line of the entire company by providing scrap/excursion control, fault detection and classification (FDC), and overall enhanced process capability. They meet regularly and team with process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.
Additional responsibilities include, but are not limited to:
Partnering with process areas to understanding tools, processes, and challenges Provide robust control solutions to all process areas in the fab according to their needs Continually support and maintain existing control solutions to ensure they are in good working order Support process conversions and changes through the WhitePaper Process Partner with process areas to develop models for controlled processes Partner with process areas to improve control on critical charts that are not meeting required standards Lead FDC system transfer by process node from TD to HVM
Qualifications
Demonstrated DMTM culture, integrity, teamwork, winning and risk taking. Experience with SPC, process control charts and statistical methods such as control limit definition, alarm rule setup, and process capability monitoring Demonstrate effectiveness in verbal and written communication, English especially Strong knowledge of DOE, data analysis, and analysis of variance (ANOVA) Strong knowledge of semiconductor fab process, tools (including metrology tools) and operation. Demonstrated analytical problem-solving skills and experience with analytical problem solving methodologies. Demonstrated self-motivation and good work ethic. Proven ability to understand technical subjects and instruct/present effectively. Strong understanding of fab data flow and tool/host communication standards, such as SECS/GEM and EDA. AMAT E3 system experience is a plus. FDC or EP (excursion prevention) experience is a plus.
Education and Experience: MS in Math, Engineering, computer science or equivalent education. Engineering level experience and knowledge of semiconductor processes and equipment is preferred. Knowledge of programming languages or scripting is also preferred.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
CN Experienced Hire JR0142433 Dalian