Director of Process Development (Ex-Pat - Dalian)
Intel Dalian is rapidly expanding its 3D NAND Dalian Technology Development (DTD) organization to develop future generations of 3D NAND process technologies.
This job requisition is to seek an experienced candidate to lead the 3D NAND process development organization based in Dalian, China, The selected candidate will partner with the Dalian high volume manufacturing organization and Intel memory technology development teams in the US to create leading edge 3D NAND process technology.
The candidate must have technology development experience and demonstrated leadership skills in a large organization, as a manager of managers, including but not limiting to safety, technology, quality, output, and cost. The selected candidate will lead and develop the process technology development organizations including photolithography, dry etch, thin films, metrology, CMP and Wet Process. Candidate is responsible for defining and executing to the NAND TD roadmap, resource planning activities, organization and leadership development to grow the organizational technical capability.
The candidate must have demonstrated the ability to solve highly complex technical problems with excellent communication skills and the ability to motivate the organization. The candidate must also have demonstrated strong ethical standards and be able to set the "tone from the top". Must also be able to lead in a highly ambiguous and dynamic business environment.
Candidate must have demonstrated a track record of excellence in creative problem solving, enabling new equipment capabilities, and process technology development for capability, cost and productivity.
Expertise in first principle problem solving as well as Fab process control systems and methodologies;
Hands-on management experiences in technology development;
The candidate must have a minimum of 15 years direct factory experience with a strong wafer fabrication technical background.
MS, or PhD in a science or engineering field;
The candidate must have direct engineering management experiences in High Volume Manufacturing (HVM) or TD factories, and must have strong experiences and knowledge in TD process engineering.
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....
Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.... US Experienced Hire JR0100399 Albuquerque
Meet Some of Intel's Employees
Martin S.SoC Design Engineer
Martin uses his communication skills and technical knowledge to perform deep-level debugs of the intellectual properties that come to Intel.
Back to top