Design Automation Engineer for Fill and Physical sign off flow
- Bangalore, India
Job Description: This role is for individual technical contributor for physical sign off tools, flow and methodologies and candidate will be expected to drive and influence methodologies for Fill and Physical sign off flow like DRC, LVS and Density . He/ She will be enabling and validating physical sign off flow through rigorous testing by developing creative and innovative testcases to avoid any escapes in flow for leading edge process nodes .The role will give opportunity to work on newest of technology and work with key stakeholders in technology, design, central CAD, and local CAD teams to drive next generation tools and codevelop methodologies, closely working with both external and internal vendors. Role also needs creative thinking to find corner cases, workarounds and ways to create self-service troubleshooting.
Qualification: Candidate should have 5+ years of relevant experience, with masters in VLSI/ Microelectronics/Electronics engineering and have worked on industry standard tools for Physical sign off. He should be well versed with various options to optimize flow in terms of quality and resources. Candidates should have good understanding of rule file/ tech files for these flows. He/ She should have good knowledge of semiconductor physics , process technology ,EDA tools and associated challenges for advance technology. He / She should have good scripting skill for automation, like TCL, perl or Python. Understanding of fabrication and process technology will be added advantage
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
IN JR0139709 Bangalore
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