Job Description
In this position, you will be responsible for the power integrity design for Intel next generation server board and system product based on Intel Processor and chipsets. Your responsibilities will include but not limit to: • Performs comprehensive simulations and validations to generate Intel design guidelines to guide system level power integrity design including, but not limit to, silicon, package, socket, boards and voltage regulators. • Performs AC and transient simulation to provide impedance profile of the whole power delivery path, from the VR to the motherboard, the package and the die. Provides guidance to the design team on capacitor numbers & values and power plane shape & width. Correlating simulations with system measurements. • Provides DC and resistance simulation to provide Rpath from the VR to the package pins, voltage drop, current density and power loss analysis. • Performs transfer impedance simulations to provide plane split and isolation guidance between interfaces on board package area.
Qualifications

M tech / MS in VLSI, Microelectronics, Power electronics or Advanced communication with a minimum of 14 years of relevant experience and have exceptional track record in delivering TTM critical products working with Global stakeholders.
Inside this Business Group
The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.

Legal Disclaimer:
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