Silicon Product Engineer - Printhead

HP is a proven leader in personal systems and printing, delivering innovations that empower people to create, interact, and inspire like never before. We leverage our strong financial position to extend our leadership in traditional markets and invest in exciting new technologies.

HP has an impressive portfolio and strong innovation pipeline across areas such as:

  • blended reality technology - our unique Sprout by HP will change the way people do things
  • 3D printing
  • multi-function printing
  • Ink in the office
  • tablets, phablets, notebooks
  • mobile workstations

We are looking for visionaries who are ready to make an impact on the way the world works. At HP, the future's yours to create!

If you are our Silicon Product Engineer - Printhead in Singapore, you will have a chance to

  • Own Engineering Responsibility for Silicon, Si Printhead Product
  • Manage and execute Si New Product Introduction, NPI or Product extension
  • Manage Si related quality escalation from downstream or customers
  • Manage Fab quality excursion by coordinating and driving containment action plan
  • Manage qualification of change for fab process, tooling and Si design
  • Gatekeeper of Si Product Quality to partners downstream
  • Collaborate with R&D, innovate and implement Si solution to Product performance, quality or margin issues

Are you a high-performer? We are looking for an individual with:

  • Bachelor's Degree in Electronics /Electrical or other relevant Engineering Degrees
  • At least 3 years of working experience as Process or Project Engineer or relevant function in semiconductor environment
  • Proven track record in project management and problem solving skills
  • Possess excellent leadership, is innovative, self-driven and a team player
  • Possess good communication skill and able to work independently
  • Strong fundamental in statistical quality control, process capability optimization and Lean 6 Sigma
  • Strong technical knowledge in electrical circuit design, wafer fabrication process, test characterization and system / process integration are advantageous

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