Research Intern, Interconnect Fabrication (PhD University Student)
Facebook's mission is to give people the power to build community and bring the world closer together. Through our family of apps and services, we're building a different kind of company that connects billions of people around the world, gives them ways to share what matters most to them, and helps bring people closer together. Whether we're creating new products or helping a small business expand its reach, people at Facebook are builders at heart. Our global teams are constantly iterating, solving problems, and working together to empower people around the world to build community and connect in meaningful ways. Together, we can help people build stronger communities â€" we're just getting started.
Facebook Reality Labs are a world leader in the design of virtual reality systems. We are currently seeking innovative research interns with a passion for technology to develop next-generation head-mounted display and imaging systems at our research location in Redmond, WA. These roles are focused on the research and development of optical components and systems towards building advanced virtual reality display systems. In particular we welcome PhD students in optical science or engineering, electrical engineering, physics, or similar.
Our internships are twelve (12) to twenty four (24) weeks long and we have various start dates throughout the year.
- Collaborate with other researchers and engineers to develop next generation interconnect technologies for use in AR/VR display prototypes with an emphasis on materials processing and assembly
- Â-Develop nanofabrication capabilities and assembly processes.
- Characterization and data analysis of material properties suited to fine pitch interconnect solutions
- Collaborate with the larger FRL team and provide creative leadership on computational display and imaging technologies.
- Pursuing a PhD degree in the field of Engineering, Electrical Engineering, Physics, or a related field
- Currently enrolled in a full time degree program and returning to the program after the completion of the internship
- 2+ years of lab experience carrying out independent research
- Strong background in materials science and semiconductor packaging
- Demonstrated ability in material characterization and analysis
- Interpersonal skills: cross-group and cross-culture collaboration
- Able to obtain work authorization in the U.S. between January 1, 2019 and December 31, 2019
- Demonstrated experience via an internship, work experience, or widely used contributions to open source projects
- Proven track record of achieving significant results as demonstrated by first-authored publications
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