Hardware Engineer, Back-end Processing (Oculus)

Facebook Reality Labs(FRL) (Facebook Inc.) has an exciting opportunity within its R&D Group at Cork for a technology development engineer who will play a key role in the developing the assembly technologies of our next generation displays. The ideal candidate will have a background in one or more of the following disciplines; Materials Science, Electrical Engineering, Physics, Optics, Mechatronics, or Mechanical Engineering. Any experience in the manipulation and handling of devices in the region of a few microns will be particularly relevant. The job is particularly suited to a technology development engineer who wishes to further develop their career in a vibrant and fast-moving research environment. This is a full-time position based in our Cork office, Ireland.


  • The successful candidate will be responsible for leading LED packaging and micro-assembly development efforts including:
  • Micro-packaging and device handling at a micro-scale.
  • Identifying materials for novel packaging techniques at micro-scale.
  • Supporting the development of state-of-art LED assembly processes and hardware.
  • Work closely with LED packaging and micro-assembly partners throughout the design, sample and engineering validation phases.
  • Identification of and management of external assembly partners.
  • Work closely with other cross-functional members to define advanced micro-assembly solutions.
  • Bachelor’s degree, preferably graduate study and qualifications in Materials Science, Electrical Engineering, Physics, Optics, Mechatronics, or Mechanical Engineering. And experience in some or all of the following:
  • Assembly, interconnection, and packaging of opto-electronic, or hybrid electronic devices.
  • Opto-electronic, compound semiconductors.
  • Deep understanding of surface chemistry, thermal effects and behavior of materials at micro-scale.
  • Deep knowledge of material characterization tools and methods at the micro-scale.
  • Knowledge of optical properties of materials at the micro-scale.
  • Knowledge of assembly and interconnection processes and equipment at the micro-scale, including process development, characterization, control, and failure analysis.
  • Experience with the interaction of materials, processes, and equipment.
  • Experience in data-set handling and analysis.
  • Managing partners and subcontractors from a technical and project management perspective.
  • Promote and support innovation to facilitate IP generation as appropriate.

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