Eng Sr Prin

BAE Systems is looking for an engineer specializing in packaging of printed circuit boards for RF applications including high speed materials. Needs a strong background in RF circuit testing including network analysis, dynamic range, noise figure, phase noise, compression and intercept points along with in-depth knowledge of integrated circuit packaging and integration. Also required is a good working knowledge of programming related to test automation and data processing (MATLAB and/or Python).

Candidate must have a good intuitive understanding of EM behavior and should understand how circuit layout drives analog/RF/microwave performance. The designer is expected to take his/her circuits through all phases of design, simulation, layout, verification, and test. A mathematical and intuitive understanding of transistor-level RF circuit design is beneficial.

The candidate must have good people skills and be able to work with limited supervision as part of a team or in a lead role. The ability to exercise discretion and independent judgment in technical areas is also important.

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