Eng I - Elec
BAE Systems is looking for an engineer specializing in packaging and layout of printed circuit boards for RF applications including high speed materials. Needs background in RF circuit testing including dynamic range, noise figure, compression and intercept points along with in-depth knowledge of integrated circuit packaging and integration. Also required is a good working knowledge of programming related to test automation and data processing (MATLAB).
Candidate must have a good intuitive understanding of EM behavior and should understand how circuit layout drives analog/RF/microwave performance. The designer is expected to take his/her circuits through all phases of design, simulation, layout, verification, and test. A mathematical and intuitive understanding of transistor-level RF circuit design is beneficial.
The candidate must have good people skills and be able to work with limited supervision as part of a team or in a lead role. The ability to exercise discretion and independent judgment in technical areas is also important.
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